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VND5004CSP30-E

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DocID027938 Rev 3 19/28
VND5004CSP30 Application information
27
3.3 Maximum demagnetization energy (V
CC
= 13.5 V)
Figure 23. Maximum turn off current versus inductance
Note: Values are generated with R
L
= 0 ȍ
In case of repetitive pulses, T
jstart
(at the beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves A and B.
1
10
100
1 10 100L (mH)
I (A)
Demagnetization Demagnetization Demagnetization
t
V
IN
, I
L
C: T
jstart
= 125°C repetitive pulse
A: T
jstart
= 150°C single pulse
B: T
jstart
= 100°C repetitive pulse
A
B
C
Package and PC board thermal data VND5004CSP30
20/28 DocID027938 Rev 3
4 Package and PC board thermal data
4.1 MultiPowerSO-30 thermal data
Figure 24. MultiPowerSO-30 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 μm (front and back
side), Copper areas: from minimum pad layout to 16 cm
2
).
Figure 25.
R
thj-amb
vs. PCB copper area in open box free air condition (one channel ON)
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DocID027938 Rev 3 21/28
VND5004CSP30 Package and PC board thermal data
27
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one
channel ON)
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30
Note: The fitting model is a simplified thermal tool and is valid for transient evolutions where the
embedded protections (power limitation or thermal cycling during thermal shutdown) are not
triggered.
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P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

VND5004CSP30-E

Mfr. #:
Buy VND5004CSP30-E
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution
Lifecycle:
New from this manufacturer.
Delivery:
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