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VND5004CSP30-E
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P28
Package and PC board thermal data
VND5004CSP30
22/28
DocID027938 Rev 3
Equation 1
: pulse calculation formula
T
able 14. Ther
mal
pa
rameters for MultiPowerSO-30
Area/island (c
m
2
)F
o
o
t
p
r
i
n
t
4
R1 (°C/W)
0.05
R2 (°C/W)
0.3
R3 (°C/W)
0.5
R4 (°C/W)
1.3
R5 (°C/W)
14
R6 (°C/W)
44.7
23.7
R7 (°C/W)
0.05
R8 (°C/W)
0.3
C1 (W
.s/°C)
0.005
C2 (W
.s/°C)
0.008
C3 (W
.s/°C)
0.01
C4 (W
.s/°C)
0.3
C5 (W
.s/°C)
0.6
C6 (W
.s/°C)
5
1
1
C7 (W
.s/°C)
0.005
C8 (W
.s/°C)
0.008
Z
TH
G
R
TH
G
Z
THtp
1
G
–
+
=
where
G
t
p
T
e
=
DocID027938 Rev 3
23/28
VND5004CSP30
Package information
27
5 Package
information
In order to meet environmenta
l requirement
s, ST offers these
devices in different grades of
ECOP
ACK
®
packages, depending on their
level
of environmental compliance. ECOP
ACK
®
specifications, grade definitions and
product status are available at:
www
.s
t.com
.
ECOP
ACK
®
is an ST trademark.
5.1
MultiPowerSO-30 p
ackage information
Figure 28. MultiPowerSO-30 pa
ckage outline
T
a
ble 15. MultiPowerSO-30 mechanical data
Symbol
Millimeters
Min.
T
yp.
Max
.
A
2.35
A2
1.85
2.25
A3
0
0.1
B
0.42
0.58
C
0.23
0.32
D
17.1
17.2
17.3
E
18.85
19.1
5
E1
15.9
16
16.1
*$3*
06
Package information
VND5004CSP30
24/28
DocID027938 Rev 3
5.2
MultiPowerSO-30 p
acking information
The devices are packed in t
ape
and reel shipments (see
T
able
16: Device summary on
pag
e 2
6
).
“e”
1
F6
14.3
F7
5.45
F8
0.73
L
0.8
1.15
N1
0
D
e
g
S
0 Deg
7 Deg
T
able 15. MultiPowerSO-30
mechanical dat
a (continued)
Symbol
Millimeters
Min.
T
yp.
Max
.
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P28
VND5004CSP30-E
Mfr. #:
Buy VND5004CSP30-E
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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