Package and PC board thermal data VND5004CSP30
22/28 DocID027938 Rev 3
Equation 1: pulse calculation formula
Table 14. Thermal parameters for MultiPowerSO-30
Area/island (cm
2
)Footprint4
R1 (°C/W) 0.05
R2 (°C/W) 0.3
R3 (°C/W) 0.5
R4 (°C/W) 1.3
R5 (°C/W) 14
R6 (°C/W) 44.7 23.7
R7 (°C/W) 0.05
R8 (°C/W) 0.3
C1 (W.s/°C) 0.005
C2 (W.s/°C) 0.008
C3 (W.s/°C) 0.01
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.6
C6 (W.s/°C) 5 11
C7 (W.s/°C) 0.005
C8 (W.s/°C) 0.008
Z
THG
R
TH
G Z
THtp
1 G+=
where
G t
p
Te=
DocID027938 Rev 3 23/28
VND5004CSP30 Package information
27
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.1 MultiPowerSO-30 package information
Figure 28. MultiPowerSO-30 package outline
Table 15. MultiPowerSO-30 mechanical data
Symbol
Millimeters
Min. Typ. Max.
A 2.35
A2 1.85 2.25
A3 0 0.1
B 0.42 0.58
C 0.23 0.32
D 17.1 17.2 17.3
E 18.85 19.15
E1 15.9 16 16.1
*$3*06
Package information VND5004CSP30
24/28 DocID027938 Rev 3
5.2 MultiPowerSO-30 packing information
The devices are packed in tape and reel shipments (see Table 16: Device summary on
page 26).
“e” 1
F6 14.3
F7 5.45
F8 0.73
L 0.8 1.15
N10 Deg
S 0 Deg 7 Deg
Table 15. MultiPowerSO-30 mechanical data (continued)
Symbol
Millimeters
Min. Typ. Max.

VND5004CSP30-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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