DATA SHEET
Product specification
Supersedes data of November 1992
1996 May 09
DISCRETE SEMICONDUCTORS
BLT81
UHF power transistor
1996 May 09 2
Philips Semiconductors Product specification
UHF power transistor BLT81
FEATURES
SMD encapsulation
Gold metallization ensures excellent reliability.
APPLICATIONS
Hand-held radio equipment in the 900 MHz
communication band.
DESCRIPTION
NPN silicon planar epitaxial transistor encapsulated in a
plastic SOT223 SMD package.
PINNING - SOT223
PIN SYMBOL DESCRIPTION
1 e emitter
2 b base
3 e emitter
4 c collector
Fig.1 Simplified outline and symbol.
handbook, halfpage
e
c
b
MAM043 - 1
4
123
Top view
QUICK REFERENCE DATA
RF performance at T
s
60 °C in a common emitter test circuit (see Fig.7).
MODE OF OPERATION
f
(MHz)
V
CE
(V)
P
L
(W)
G
p
(dB)
η
C
(%)
CW, class-B narrow band 900
7.5 1.2 6 60
6 1.2 typ. 6.5 typ. 77
1996 May 09 3
Philips Semiconductors Product specification
UHF power transistor BLT81
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter 20 V
V
CEO
collector-emitter voltage open base 9.5 V
V
EBO
emitter-base voltage open collector 2.5 V
I
C
collector current (DC) 500 mA
I
C(AV)
average collector current 500 mA
P
tot
total power dissipation T
s
=110°C; note 1 2W
T
stg
storage temperature 65 +150 °C
T
j
operating junction temperature 175 °C
Fig.2 DC SOAR.
T
s
= 110 °C.
handbook, halfpage
MRC094
10
1
10
2
1
110
I
C
(A)
V
CE
(V)
THERMAL CHARACTERISTICS
Note to the “Limiting values” and “Thermal characteristics”
1. T
s
is the temperature at the soldering point of the collector pin.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
thermal resistance from junction to soldering point P
tot
=2W; T
s
=110°C; note 1 32 K/W

BLT81,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RF Bipolar Transistors NPN 6-7.5V 500mA UHF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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