1996 May 09 7
Philips Semiconductors Product specification
UHF power transistor BLT81
List of components used in test circuit (see Figs 7 and 8)
Notes
1. American Technical Ceramics type 100B or capacitor of same quality.
2. The striplines are on a double copper-clad printed-circuit board, with PTFE fibre-glass dielectric (ε
r
= 2.2); thickness
1
⁄
16
"; thickness of the copper sheet 35 µm.
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No.
C1, C14 multilayer ceramic chip capacitor; note 1 100 pF
C2 multilayer ceramic chip capacitor; note 1 3 pF
C3, C5, C11, C13 film dielectric trimmer 1.4 to 5.5 pF 2222 809 09004
C4 multilayer ceramic chip capacitor; note 1 5.6 pF
C6, C7, C10 multilayer ceramic chip capacitor; note 1 5.1 pF
C8 multilayer ceramic chip capacitor; note 1 3.6 pF
C9 multilayer ceramic chip capacitor; note 1 220 pF
C12 multilayer ceramic chip capacitor; 1 nF
L1 stripline; note 2 50 Ω length 26.6 mm
width 4.85 mm
L2 10 turns enamelled 0.6 mm copper wire 250 nH int. dia. 4.5 mm
leads 2 × 5mm
L3, L9 grade 3B Ferroxcube wideband
HF choke
4312 020 36640
L4 stripline; note 2 50 Ω length 18 mm
width 4.85 mm
L5 stripline; note 2 75 Ω length 3.5 mm
width 2.5 mm
L6 stripline; note 2 50 Ω length 10 mm
width 4.85 mm
L7 4 turns enamelled 0.6 mm copper wire 65 nH int. dia. 4.5 mm
leads 2 × 5mm
L8 stripline; note 2 50 Ω length 15 mm
width 4.85 mm
L10 stripline; note 2 50 Ω length 24.6 mm
width 4.85 mm
R1, R2 metal film resistor 10 Ω, 0.25 W
