NXP Semiconductors
GTL2008
GTL translator with power good control and high-impedance outputs
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 February 2010
Document identifier: GTL2008_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
20. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 5
7.1 Function tables . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Application design-in information . . . . . . . . . . 7
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Recommended operating conditions. . . . . . . . 8
11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
12 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12.1 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 14
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
15 Soldering of SMD packages . . . . . . . . . . . . . . 16
15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 16
15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 16
15.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16
15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18
17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
19 Contact information. . . . . . . . . . . . . . . . . . . . . 21
20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
