DMC3025LSD-13

DMC3025LSD
Document number: DS35717 Rev. 7 - 2
1 of 10
www.diodes.com
February 2015
© Diodes Incorporated
DMC3025LSD
ADVANCED I NF O R M A T I O N
30V COMPLEMENTARY ENHANCEMENT MODE MOSFET
Product Summary
Device
V
(BR)DSS
R
DS(ON) max
Package
I
D MAX
T
A
= +25°C
N-Channel
30V
20m @ V
GS
= 10V
SO-8
8.5A
32m @ V
GS
= 4.5V
7.0A
P-Channel
-30V
45m @ V
GS
= -10V
-5.5A
85m @ V
GS
= -4.5V
-4.1A
Description
This MOSFET is designed to minimize the on-
state resistance
(R
DS(ON)
) and yet maintain superior switching performance, making it
ideal for high-efficiency power management applications.
Applications
DC Motor Control
DC-AC Inverters
Features
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish Matte Tin Annealed Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (Approximate)
Ordering Information
(Note 4)
Part Number
Case
Packaging
DMC3025LSD-13 SO-8 2,500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Pin Configuration
S2
D1
D2
G1
D2
D1
G2
S1
Top View
SO-8
Equivalent Circuit
Top View
Logo
Part no.
Year: “11” = 2011
1
4
8 5
C3025LD
YY WW
Xth week: 01 ~ 53
Q2 N-
CHANNEL MOSFET
Q1 P-CHANNEL MOSFET
D2
S2
G2
D1
S1
G1
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
2 of 10
www.diodes.com
February 2015
© Diodes Incorporated
DMC3025LSD
ADVANCED I NF O R M A T I O N
Maximum Ratings N-CHANNEL– Q2
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
30 V
Gate-Source Voltage
V
GSS
±20 V
Continuous Drain Current (Note 5) V
GS
= 10V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
6.5
5.1
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
8.5
6.8
A
Continuous Drain Current (Note 5) V
GS
= 4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
5.3
4.1
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
7.0
5.5
A
Maximum Continuous Body Diode Forward Current (Note 5)
I
S
2 A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
60 A
Pulsed Body Diode Current (10µs pulse, duty cycle = 1%)
I
SM
60 A
Avalanche Current (Note 7) L = 0.1mH
I
AS
14 A
Avalanche Energy (Note 7) L = 0.1mH
E
AS
10 mJ
Maximum Ratings P-CHANNEL– Q1
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
-30 V
Gate-Source Voltage
V
GSS
±20 V
Continuous Drain Current (Note 5) V
GS
= -10V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-4.2
-3.2
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
-5.5
-4.3
A
Continuous Drain Current (Note 5) V
GS
= -4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-3.5
-2.3
A
t<10s
T
A
= +25°C
T
A
= +70°C
I
D
-4.1
-3.2
A
Maximum Continuous Body Diode Forward Current (Note 5)
I
S
-2 A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
I
DM
-30 A
Pulsed Body Diode Current (10µs pulse, duty cycle = 1%)
I
SM
-30 A
Avalanche Current (Note 7) L = 0.1mH
I
AS
-14 A
Avalanche Energy (Note 7) L = 0.1mH
E
AS
10 mJ
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 6)
T
A
= +25°C
P
D
1.2
W
T
A
= +70°C
0.77
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
R
θ
JA
104
°C/W
t<10s 62
Total Power Dissipation (Note 5)
T
A
= +25°C
P
D
1.5
W
T
A
= +70°C
0.95
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
R
θ
JA
83
°C/W
t<10s 49
Thermal Resistance, Junction to Case (Note 5)
R
θ
JC
15
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150 °C
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
DMC3025LSD
Document number: DS35717 Rev. 7 - 2
3 of 10
www.diodes.com
February 2015
© Diodes Incorporated
DMC3025LSD
ADVANCED I NF O R M A T I O N
Electrical Characteristics N-CHANNEL– Q2
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BV
DSS
30
V
V
GS
= 0V, I
D
= 250µA
Zero Gate Voltage Drain Current
I
DSS
1 µA
V
DS
= 30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
±1 µA
V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
V
GS(th)
1.0 2.0 V
V
DS
= V
GS
, I
D
= 250µA
Static Drain-Source On-Resistance
R
DS (ON)
15 20
m
V
GS
= 10V, I
D
= 7.4A
23 32
V
GS
= 4.5V, I
D
= 6A
Forward Transfer Admittance
|Y
fs
|
8 S
V
DS
= 5V, I
D
= 10A
Diode Forward Voltage
V
SD
0.70 1.2 V
V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
C
iss
501
pF
V
DS
= 15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
72
Reverse Transfer Capacitance
C
rss
57
Gate Resistance
R
g
1.84
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= 4.5V) Q
g
4.6
nC
V
DS
= 15V, I
D
= 10A
Total Gate Charge (V
GS
= 10V) Q
g
9.8
Gate-Source Charge
Q
gs
1.6
Gate-Drain Charge
Q
gd
2.0
Turn-On Delay Time
t
D(on)
3.9
ns
V
DD
= 15V, V
GS
= 10V,
R
G
= 6, I
D
= 1A
Turn-On Rise Time
t
r
4.2
Turn-Off Delay Time
t
D(off)
16.6
Turn-Off Fall Time
t
f
5.8
Reverse Recovery Time
t
rr
5.5
ns
I
F
= 12A, di/dt = 500A/µs
Reverse Recovery Charge
Q
rr
2.6
nC

DMC3025LSD-13

Mfr. #:
Manufacturer:
Diodes Incorporated
Description:
MOSFET 30V Comp ENH Mode 25 to 30V MosFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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