9397 750 14031 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 26 January 2005 5 of 12
Philips Semiconductors
PH4530L
N-channel TrenchMOS™ logic level FET
6. Characteristics
Table 5: Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown voltage I
D
= 250 µA; V
GS
=0V 30--V
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
=V
GS
; Figure 9 1 1.5 2 V
I
DSS
drain-source leakage current V
DS
=30V; V
GS
=0V
T
j
=25°C - 0.06 1 µA
T
j
= 150 °C - - 500 µA
I
GSS
gate-source leakage current V
GS
= ±15 V; V
DS
= 0 V - 2 100 nA
R
DSon
drain-source on-state resistance V
GS
= 10 V; I
D
=15A;Figure 7 and 8
T
j
=25°C - 4.8 5.7 mΩ
T
j
= 150 °C - 8.2 9.7 mΩ
V
GS
=5V; I
D
=15A;Figure 7 and 8 - 5.8 7.2 mΩ
Dynamic characteristics
Q
g(tot)
total gate charge I
D
= 25 A; V
DS
=10V; V
GS
=5V;
Figure 13
- 23.5 - nC
Q
gs
gate-source charge - 5.8 - nC
Q
gd
gate-drain (Miller) charge - 6.5 - nC
C
iss
input capacitance V
GS
=0V; V
DS
= 10 V; f = 1 MHz;
Figure 11
-1972-pF
C
oss
output capacitance - 769 - pF
C
rss
reverse transfer capacitance - 304 - pF
t
d(on)
turn-on delay time V
DS
=10V; I
D
= 25 A;
V
GS
=5V;R
G
= 4.7 Ω
-22-ns
t
r
rise time -40-ns
t
d(off)
turn-off delay time - 48 - ns
t
f
fall time -18-ns
Source-drain diode
V
SD
source-drain (diode forward) voltage I
S
= 15 A; V
GS
=0V;Figure 12 - 0.85 1.2 V
t
rr
reverse recovery time I
S
= 20 A; dI
S
/dt = −100 A/µs; V
GS
=0V - 38 - ns