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TLP291(E)

P1-P3P4-P6P7-P9P10-P12P13-P13
TLP291
2014-09-22
7
V
CE(sat)
- Ta
I
C
- Ta
Collector-emitter saturation voltage
V
CE(sat)
(V)
Collector current I
C
(mA)
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Switching time - R
L
Switching time - Ta
Switching time (μs)
Switching time (μs)
Load resistance R
L
(kΩ)
Ambient temperature Ta (°C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
0.00
0.04
0.08
0.12
0.16
0.20
0.24
0.28
-60 -40 -20 0 20 40 60 80 100 120
0.1
1
10
100
-60 -40 -20 0 20 40 60 80 100 120
1
10
100
1000
10000
110100
0.1
1
10
100
1000
-60 -40 -20 0 20 40 60 80 100 120
I
F
=8mA, I
C
=2.4mA
I
F
=1mA, I
C
=0.2mA
V
CE
=5V
I
F
=0.5m
A
5
1
10
25
t
off
Ta=2 5˚C
I
F
=16mA
V
CC
=5V
I
F
=16mA
V
CC
=5V
R
L
=1.9k
t
s
t
on
t
off
t
s
T
on
TLP291
2014-09-22
8
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
·Temperature profile example of using lead (Pb)-free solder
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
· Please preheat it at 150°C between 60 and 120 seconds.
· Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
Time (s)
(°C)
240
210
160
60 to 120s
less than 30s
Package surface temperature
140
Time
(s)
(°C)
260
230
190
60 to 120s
30 to 50s
180
Package surface temperature
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
TLP291
2014-09-22
9
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
P1-P3P4-P6P7-P9P10-P12P13-P13

TLP291(E)

Mfr. #:
Buy TLP291(E)
Manufacturer:
Toshiba
Description:
Transistor Output Optocouplers Photocoupler 80V 50mA 3750Vrms
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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