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ADG936BRUZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
Data Sheet ADG936/ADG936-R
Rev. B | Page 13 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
COPLANARIT
Y
0.10
Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ADG936/ADG936-R Data Sheet
Rev. B | Page 14 of 16
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
2
ADG936BRU –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-500RL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ-REEL –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ-REEL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BCPZ –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG936BCPZ-RL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG936BCPZ-RL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
EVAL-ADG936EBZ Evaluation Board RU-20
ADG936BRU-R
–40°C to +85°C
20-Lead Thin Shrink Small Outline Package (TSSOP)
RU-20
ADG936BRU-R-500RL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-R-REEL –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-R-REEL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ-R –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BCPZ-R –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG936BCPZ-R-REEL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
EVAL-ADG936REBZ Evaluation Board RU-20
1
Z = RoHS Compliant Part.
2
CP-20-6 package was formerly CP-20-1 package
Data Sheet ADG936/ADG936-R
Rev. B | Page 15 of 16
NOTES
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

ADG936BRUZ

Mfr. #:
Buy ADG936BRUZ
Manufacturer:
Analog Devices Inc.
Description:
RF Switch ICs WB 4GHz 36dB Iso CMOS Dual SPDT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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