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ADG936BRUZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
ADG936/ADG936-R Data Sheet
Rev. B | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 2.
Parameter Rating
V
DD
to GND –0.5 V to +4 V
Inputs to GND –0.5 V to V
DD
+ 0.3 V
1
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) –40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature 150°C
TSSOP Package
θ
JA
Thermal Impedance 143°C/W
LFCSP Package
θ
JA
Thermal Impedance (4-Layer Board) 30.4°C/W
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
ESD 1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
Table 3. Truth Table
INx RF1x RF2x
0 Off On
1 On Off
1
RF1x/RF2x off port inputs to ground = –0.5 V to V
DD
– 0.5 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
proprietary ESD protection circuitry, permanent damage may occur on
degradation or loss of functionality.
Data Sheet ADG936/ADG936-R
Rev. B | Page 5 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
20
19
18
17
16
15
14
13
V
DD
GND
RF1A
GND
GND
RF1B
GND
GND
INA
GND
RF2A
GND
GND
RF2B
GND
ADG936
ADG936-R
TOP VIEW
(Not to Scale)
RFC
A
9
10
12
11
GND
RFCB
INB
GND
04503-002
04503-003
NOTES
1. EXPOSED PAD TIED TO SUBSTATE, GND.
14
13
12
1
3
4
RF2A
15 GND
GND
GND
11
RF2B
GND
GND
2
RF1A
GND
5
RF1B
7
GND
6
GND
8
RFCB
9
GND
10
INB
19
V
DD
20
GND
18
RFC
A
17
GND
16
IN
A
ADG936
ADG936-R
TOP VIEW
(Not to Scale)
Figure 5. 20-Lead TSSOP (RU-20) Figure 6. 20-Lead 4 mm × 4 mm LFCSP (CP-20-1)
Table 4. Pin Function Descriptions
Pin No.
20-Lead
TSSOP
20-Lead
LFCSP Mnemonic Description
1 18 RFCA Common RF Port for Switch A.
2 19 V
DD
Power Supply Input. These parts can operate from 1.65 V to 2.75 V. V
DD
should be decoupled
to GND.
3, 5, 6, 8, 9,
11, 13, 15,
16, 18, 20
1, 3, 4, 6, 7,
9, 12, 13,
15, 17, 20
GND Ground Reference Point for All Circuitry on the Part.
4 2 RF1A RF1A Port.
7 5 RF1B RF1B Port.
10 8 RFCB Common RF Port for Switch B.
12 10 INB Logic Control Input.
14 11 RF2B RF2B Port.
17 14 RF2A RF2A Port.
19 16 INA Logic Control Input.
EP EP Exposed Pad. The exposed pad must be tied to substrate, GND.
ADG936/ADG936-R Data Sheet
Rev. B | Page 6 of 16
TERMINOLOGY
Table 5.
Parameter Description
V
DD
Most Positive Power Supply Potential.
I
DD
Positive Supply Current.
GND Ground (0 V) Reference.
INx Logic Control Input.
V
INL
Maximum Input Voltage for Logic 0.
V
INH
Minimum Input Voltage for Logic 1.
I
INL
(I
INH
)
Input Current of the Digital Input.
C
IN
Digital Input Capacitance.
t
ON
Delay Between Applying the Digital Control Input and the Output Switching On.
t
OFF
Delay Between Applying the Digital Control Input and the Output Switching Off.
t
RISE
Rise Time. Time for the RF signal to rise from 10% of the on level to 90% of the on level.
t
FAL L
Fall Time. Time for the RF signal to fall from 90% of the on level to 10% of the on level.
Off Isolation The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the Off
Condition.
Insertion Loss The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the On
Condition.
Crosstalk Measure of Unwanted Signal Coupled Through from One Channel to Another as a Result of Parasitic Capacitance.
P
–1 dB
1 dB Compression Point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level
value. P
–1 dB
is a measure of how much power the on switch can handle before the insertion loss increases by 1 dB.
IP
3
Third-Order Intermodulation Intercept. This is a measure of the power in false tones that occurs when closely spaced
tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.
Return Loss The Amount of Reflected Power Relative to the Incident Power at a Port. Large return loss indicates good matching. By
measuring return loss, the voltage standing wave ratio (VSWR) can be calculated from conversion charts. VSWR
indicates the degree of matching present at a switch RF port.
Video Feedthrough Spurious Signals Present at the RF Ports of the Switch When the Control Voltage Is Switched from High to Low or from
Low to High Without an RF Signal Present.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

ADG936BRUZ

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Manufacturer:
Analog Devices Inc.
Description:
RF Switch ICs WB 4GHz 36dB Iso CMOS Dual SPDT
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