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6-102203-1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33
PCA9671 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 29 September 2011 22 of 33
NXP Semiconductors
PCA9671
Remote 16-bit I/O expander for Fm+ I
2
C-bus with reset
[5] The maximum t
f
for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage t
f
is specified at
250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without
exceeding the maximum specified t
f
.
[6] Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns.
Rise and fall times refer to V
IL
and V
IH
.
Fig 23. I
2
C-bus timing diagram
002aab175
protocol
START
condition
(S)
bit 7
MSB
(A7)
bit 6
(A6)
bit 0
(R/W)
acknowledge
(A)
STOP
condition
(P)
SCL
SDA
t
HD;STA
t
SU;DAT
t
HD;DAT
t
f
t
BUF
t
SU;STA
t
LOW
t
HIGH
t
VD;ACK
t
SU;STO
1
/ f
SCL
t
r
t
VD;DAT
0.3 × V
DD
0.7 × V
DD
0.3 × V
DD
0.7 × V
DD
Fig 24. Reset timing
SDA
SCL
002aac282
t
rst
50 %
30 %
50 % 50 %
50 %
t
rec(rst)
t
w(rst)
RESET
P0n, P1n
output off
START
t
rst
ACK or read cycle
PCA9671 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 29 September 2011 23 of 33
NXP Semiconductors
PCA9671
Remote 16-bit I/O expander for Fm+ I
2
C-bus with reset
14. Package outline
Fig 25. Package outline SOT137-1 (SO24)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v M
A
13
(A )
3
A
y
0.25
075E05 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.61
0.60
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
99-12-27
03-02-19
PCA9671 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 3 — 29 September 2011 24 of 33
NXP Semiconductors
PCA9671
Remote 16-bit I/O expander for Fm+ I
2
C-bus with reset
Fig 26. Package outline SOT355-1 (TSSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153
99-12-27
03-02-19
0.25
0.5
0.2
w M
b
p
Z
e
112
24
13
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
A
max.
1.1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33

6-102203-1

Mfr. #:
Buy 6-102203-1
Manufacturer:
TE Connectivity / AMP Connectors
Description:
Headers & Wire Housings SHROUDED RA SNGL 14 with standoffs
Lifecycle:
New from this manufacturer.
Delivery:
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