QT1103-ISG Datasheet QT1103-ISG | P19-P21

4.8 Mechanical Dimensions

Symbol Minimum Nominal Maximum

A 0.70 - 0.95

A1 0.00 0.02 0.05

b 0.18 0.25 0.32

C-0.20REF-

D 4.90 5.00 5.10

D2 3.05 - 3.65

E 4.90 5.00 5.10

E2 3.05 - 3.65

e-0.50-

L 0.30 0.40 0.50

y0.00-0.075

DimensionsIn Millimeters

Note: that there is no functional requirement for the large pad on the underside of the 32-QFN

package to be soldered to the substrate. If the final application does require this area to be soldered

for mechanical reasons, the pad(s) to which it is soldered to must be isolated and contained under the

32-QFN footprint only.

19 QT1103_3R0.03_0607

4.9 Part Marking

4.10 Moisture Sensitivity Level (MSL)

IPC/JEDEC J-STD-020C260

CMSL3

SpecificationsPeak Body TemperatureMSL Rating

20 QT1103_3R0.03_0607

YYWWG

run nr.

‘YY’ = Year of manufacture

‘WW’ = Week of manufacture

‘G’ = Green/RoHS Compliant

Pin 1

Identification

QRG Revision

Code

QT1103

©QRG 3

QRG Part

Number

'run nr.' = 6 Digit Run Number

5 Datasheet Control

5.1 Changes

Changes this issue (datasheet issue 03)

Front page.

5.2 Numbering Convention

Part Number

QT1103_MXN.nn_mmyy

Chip Revision

(Where M= Major chip revision,

N = Minor chip revision,

X = Prereleased Product

[or R = Released Product])

Datasheet Issue Number

Datasheet Release Date;

(Where mm = Month, yy = Year)

A minor chip revision (N) is defined as a revision change which does not affect product functionality or datasheet.

The value of N is only stated for released parts (R).

lQ 21 QT1103_3R0.03_0607

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P22

QT1103-ISG

Mfr. #:

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Description:

IC SENSOR QTOUCH 10CH 32QFN

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QT1103-ISG