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CBTL02042ABQ,115

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
CBTL02042A_CBTL02042B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 10 March 2011 4 of 16
NXP Semiconductors
CBTL02042A; CBTL02042B
3.3 V, 2 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen2
[1] DHVQFN20 package die supply ground is connected to both GND pins and exposed center pad. GND pins
and the exposed center pad must be connected to supply ground for proper device operation. For
enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the
board using a corresponding thermal pad on the board and for proper heat conduction through the board,
thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.
7. Functional description
Refer to Figure 1 “Functional diagram of CBTL02042A; CBTL02042B”.
7.1 Function selection and shutdown function
The CBTL02042A/B provides a shutdown function to minimize power consumption when
the application is not active, but power to the CBTL02042A/B is provided. The XSD pin
(active HIGH) places all channels in high-impedance state (non-conducting) while
reducing current consumption to near-zero. When XSD pin is LOW, the device operates
normally.
XSD 2 19 CMOS
single-ended
input
Shutdown pin; should be driven
LOW or connected to V
SS
for
normal operation. When HIGH, all
paths are switched off
(non-conducting high-impedance
state), and supply current
consumption is minimized.
V
DD
1, 6, 10 11, 16, 20 power positive supply voltage,
3.3 V (± 10 %)
GND
[1]
5, 11, 20,
center pad
1, 10, 15,
center pad
power supply ground
Table 2. Pin description
…continued
Symbol Pin Type Description
CBTL02042A CBTL02042B
Table 3. Function selection
X = Don’t care.
XSD SEL Function
HIGH X An, Bn and Cn pins are high-Z
LOW LOW An to Bn and vice versa
LOW HIGH An to Cn and vice versa
CBTL02042A_CBTL02042B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 10 March 2011 5 of 16
NXP Semiconductors
CBTL02042A; CBTL02042B
3.3 V, 2 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen2
8. Application design-in information
Fig 3. Applications using CBTL02042A
Fig 4. Application using CBTL02042B
002aaf776
MINI CARD/
mSATA
CONNECTOR
CBTL02042A
eSATA
CONTROLLER
PCIe
CONTROLLER
eSATA/USB 3.0
COMBO
CONNECTOR
CBTL02042A
eSATA
CONTROLLER
USB 3.0
CONTROLLER
002aaf777
USB 3.0
CONNECTOR
CBTL02042B
USB 3.0
CONTROLLER
USB 3.0
CONNECTOR
CBTL02042A_CBTL02042B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 10 March 2011 6 of 16
NXP Semiconductors
CBTL02042A; CBTL02042B
3.3 V, 2 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen2
9. Limiting values
[1] Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model -
Component level; Electrostatic Discharge Association, Rome, NY, USA.
[2] Charged Device Model: ANSI/EOS/ESD-S5.3-1-1999, standard for ESD sensitivity testing, Charged Device
Model - Component level; Electrostatic Discharge Association, Rome, NY, USA.
10. Recommended operating conditions
11. Static characteristics
[1] Typical values are at V
DD
= 3.3 V, T
amb
=25°C, and maximum loading.
[2] Input leakage current is ±50 μA if differential pairs are pulled to HIGH and LOW.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DD
supply voltage −0.3 +4.6 V
T
case
case temperature −40 +85 °C
V
ESD
electrostatic discharge voltage HBM
[1]
- 8000 V
CDM
[2]
- 1000 V
Table 5. Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
V
DD
supply voltage 3.0 3.3 3.6 V
V
I
input voltage - - V
DD
V
T
amb
ambient temperature operating in free air −40 - +85 °C
Table 6. Static characteristics
V
DD
= 3.3 V
±
10 %; T
amb
=
−
40
°
C to +85
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
I
DD
supply current V
DD
= max.; V
I
=GNDorV
DD
;
XSD = LOW
-1.352.5mA
I
stb
standby current V
DD
= max.; V
I
=GNDorV
DD
;
XSD = HIGH
--1μA
I
IH
HIGH-level input current V
DD
= max.; V
I
=V
DD
--±5
[2]
μA
I
IL
LOW-level input current V
DD
= max.; V
I
=GND - - ±5
[2]
μA
V
IH
HIGH-level input voltage SEL, XSD pins 0.65V
DD
-- V
V
IL
LOW-level input voltage SEL, XSD pins - - 0.35V
DD
V
V
I
input voltage differential pins - - 2.4 V
SEL, XSD pins - - V
DD
V
V
IC
common-mode input
voltage
0-2.0V
V
ID
differential input voltage peak-to-peak - - 1.6 V
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

CBTL02042ABQ,115

Mfr. #:
Buy CBTL02042ABQ,115
Manufacturer:
NXP Semiconductors
Description:
Multiplexer Switch ICs 3.3V 2 DIFF CH 2:1 MULTI/DEMUX SW
Lifecycle:
New from this manufacturer.
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