HMC213BMS8E Data Sheet
Rev. 0 | Page 4 of 21
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 13 dBm
LO Input Power 27 dBm
IF Input Power 13 dBm
IF Source/Sink Current 9 mA
Reflow Temperature 260°C
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 15.9 mW/°C Above 85°C)
1.424 W
Maximum Junction Temperature 175°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model 2000 V
Field Induced Charged Device Model 1250 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θ
JA
is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θ
JC
is the junction to
case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
RM-8
1
165.6 63 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
