© Semiconductor Components Industries, LLC, 2012
March, 2012 Rev. 1
1 Publication Order Number:
NB3N121K/D
NB3N121K
3.3V Differential 1:21
Fanout Clock and Data
Driver with HCSL Outputs
Description
The NB3N121K is a differential 1:21 Clock and Data fanout buffer
with Highspeed Current Steering Logic (HCSL) outputs optimized
for ultra low propagation delay variation. The NB3N121K is designed
with HCSL PCI Express clock distribution and FBDIMM applications
in mind.
Inputs can directly accept differential LVPECL, HCSL, and LVDS
signals per Figures 7, 8, and 9. Single ended LVPECL, HCSL,
LVCMOS, or LVTTL levels are accepted with a proper external V
th
reference supply per Figures 4 and 10. Input pins incorporate separate
internal 50 W termination resistors allowing additional single ended
system interconnect flexibility.
Output drive current is set by connecting a 475 W resistor from
IREF (Pin 1) to GND per Figure 6. Outputs can also interface to
LVDS receivers when terminated per Figure 11.
The NB3N121K specifically guarantees low output–to–output
skew. Optimal design, layout, and processing minimize skew within a
device and from device to device. System designers can take
advantage of the NB3N121K’s performance to distribute low skew
clocks across the backplane or the motherboard.
Features
Typical Input Clock Frequency 100, 133, 166, 200, 266, 333 and
400 MHz
340 ps Typical Rise and Fall Times
800 ps Typical Propagation Delay
100 ps Max Within Device Skew
150 ps Max DevicetoDevice Skew
Dtpd 100 ps Maximum Propagation Delay Variation Per Each
Differential Pair
0.1 ps Typical RMS Additive Phase Jitter
LVDS Output Levels Optional with Interface Termination
Operating Range: V
CC
= 3.0 V to 3.6 V with GND = 0 V
Typical HCSL Output Level (700 mV PeaktoPeak)
These are PbFree Devices
Applications
Clock Distribution
PCIe I, II, III
Networking
High End Computing
Routers
End Products
Servers
FBDIMM Memory Card
A = Assembly Site
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbFree Package
*For additional marking information, refer to
Application Note AND8002/D.
QFN52
MN SUFFIX
CASE 485M
MARKING DIAGRAM*
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NB3N
121K
AWLYYWWG
1
52
Figure 1. Simplified Logic Diagram
Q0
Q0
Q1
Q1
Q19
Q19
Q20
Q20
CLK
CLK
V
CC
GND
R
REF
IREF
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
VTCLK
VTCLK
152
NB3N121K
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2
Figure 2. Pinout Configuration (Top View)
VCC
Q0
Q1
Q1
Q2
Q2
Q3
Q4
Q4
IREF
VCC
Q6
Q3
Q5
Q5
GND
Q20
Q8
Q9
Q11
Q11
Q17
Q14
Q13
Q14
Q13
Q16
1
2
3
4
5
6
7
8
9
10
11
12
13
VTCLK
CLK
CLK
VTCLK
V
CC
Q20
Q19
Q19
Q18
Q18
14
15
16
17
18
19
20
21
22
23
24
25
26
Q17
Q16
Q15
Q15
Q12
Q12
VCC
39
38
37
36
35
34
33
32
31
30
29
28
27
Q10
Q10
Q9
Q8
Q7
Q7
Q6
52
51
50
49
48
47
46
45
44
43
42
41
40
Q0
Exposed Pad (EP)
NB3N121K
NB3N121K
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3
Table 1. PIN DESCRIPTION
Pin Name I/O Description
1 IREF Output
Use the IREF pin to set the output drive. Connect a 475 W RREF resist-
or from the IREF pin to GND to produce 2.63 mA of IREF current. A
current mirror multiplies IREF by a factor of 5.4 to force 14.2 mA through
a 50 W output load. See Figures 6 and 12. Minimize capacitance.
2 GND Supply Ground. GND pin must be externally connected to power supply
to guarantee proper operation.
3, 6 VTCLK,
VTCLK
Internal 50 W Termination Resistor connection Pins. In the differential
configuration when the input termination pins are connected to the com-
mon termination voltage, and if no signal is applied then the device may
be susceptible to selfoscillation.
4 CLK LVPECL,
HCSL,
LVCMOS or
LVTTL Input
Clock (TRUE) Input
5 CLK LVPECL,
HCSL,
LVCMOS or
LVTTL Input
Clock (INVERT) Input
7, 26, 39, 52 VCC Positive Supply pins. VCC pins must be externally connected to a power
supply to guarantee proper operation.
8, 10, 12, 14, 16, 18, 20, 22,
24, 27, 29, 31, 33, 35, 37,
40,42, 44, 46, 48, 50
Q[200] HCSL or LVDS
(Note 1) Output
Output (INVERT) (Note 1)
9, 11, 13, 15, 17, 19, 21, 23,
25, 28, 30, 32, 34, 36, 38,
41, 43, 45, 47, 49, 51
Q[200] HCSL or LVDS
(Note 1) Output
Output (TRUE) (Note 1)
Exposed Pad EP GND Exposed Pad. The thermally exposed pad (EP) on package bottom (see
case drawing) must be attached to a sufficient heatsinking conduit for
proper thermal operation. The pad is electrically connected ot GND and
must be connected to GND on the PC board.
1. Outputs can also interface to LVDS receiver when terminated per Figure 11.

NB3N121KMNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 3.3V 1:21 DIFF FANOUT CLO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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