© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. 7
1 Publication Order Number:
NB3F8L3010C/D
NB3F8L3010C
3.3V / 2.5V / 1.8V / 1.5V
3:1:10 LVCMOS Fanout Buffer
Description
The NB3F8L3010C is a 3:1:10 Clock / Data fanout buffer operating
on a 3.3 V / 2.5 V Core V
DD
and two flexible 3.3 V / 2.5 V / 1.8 V /
1.5 V VDDO
n
supplies which must be equal or less than V
DD
.
A Mux selects between a Crystal input, or either of two
differential/SE Clock / Data inputs. Differential Inputs accept
LVPECL, LVDS, HCSL, or SSTL and Single−Ended levels. The
MUX control lines, SEL0 and SEL1, select CLK0/CLK0
,
CLK1/CLK1
, or Crystal input pins per Table 3. The Crystal input is
disabled when a Clock input is selected. Output enable pin, OE,
synchronously forces a High Impedance state (HZ) when Low per
Table 4.
Outputs consist of 10 single−ended LVCMOS outputs.
Features
Ten CMOS / LVTTL Outputs up to 200 MHz
Differential Inputs Accept LVPECL, LVDS, HCSL, or SSTL
Crystal Oscillator Interface
Crystal Input Frequency Range: 10 MHz to 50 MHz
Output Skew: 10 ps Typical
Additive RMS Phase Jitter @ 125 MHz, (12 kHz – 20 MHz): 0.03 ps
(Typical)
Synchronous Output Enable
Output Defined Level When Input is Floating
Power Supply Modes:
Single 3.3 V
Single 2.5 V
Mixed 3.3 V ± 5% Core/2.5 V ± 5% Output Operating Supply
Mixed 3.3 V ± 5% Core/1.8 V ± 0.2 V Output Operating Supply
Mixed 3.3 V ± 5% Core/1.5 V ± 0.15 V Output Operating Supply
Mixed 2.5 V ± 5% Core/ 1.8 V ± 0.2 V Output Operating Supply
Mixed 2.5 V ± 5% Core /1.5 V ± 0.15 V Output Operating Supply
Two Separate Output Bank Power Supplies
Industrial temp. range -40°C to 85°C
These are Pb−Free Devices
Applications
Clock Distribution
Networking and Communications
High End Computing
Wireless and Wired Infrastructure
End Products
Servers
Ethernet Switch/Routers
AT E
Test and Measurement
MARKING
DIAGRAM
QFN32
G SUFFIX
CASE 488AM
www.onsemi.com
See detailed ordering and shipping information page 12 of this
data sheet.
ORDERING INFORMATION
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
32
1
NB3F8L
3010C
AWLYYWWG
1
NB3F8L3010C
www.onsemi.com
2
Figure 1. Simplified Logic Diagram
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
VDD
VDDOA
VDDOB
GND
SEL0
SEL1
CLK0
CLK1
XTAL_IN
XTAL_OUT
OE
SYNC
OSC
CLK1
CLK0
BANK A
BANK B
Figure 2. Pinout Configuration (Top View)
CLK1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
24
23
22
21
20
19
18
17
32
31
30
29
28
27
26
25
Exposed Pad (EP)
NB3F8L3010C
Q0
VDDOA
Q1
GND
Q2
VDDOA
Q3
Q4
Q9
VDDOB
Q8
GND
Q7
VDDOB
Q6
Q5
GND
OE
SEL0
SEL1
CLK1
GND
GND
CLK0
GND
GND
CLK0
XTAL_OUT
XTAL_IN
VDD
GND
NB3F8L3010C
www.onsemi.com
3
Table 1. PIN DESCRIPTION
Number Name Type
Input
Default
Description
1, 3, 5, 7,
8
Q0, Q1, Q2,
Q3, Q4
LVCMOS Outputs − Bank A
17, 18,
20, 22, 24
Q5, Q6, Q7,
Q8, Q9
LVCMOS Outputs − Bank B
2, 6 VDDOA Power Positive Supply Pins for Bank A Outputs Q0 − Q4
19, 23 VDDOB Power Positive Supply Pins for Bank B Outputs Q5 − Q9
4, 9, 15,
16, 21,
25, 26, 32
GND GND Ground Supply
10 VDD Power V
DD
Positive Supply pin for Core and Inputs.
11 XTAL_IN XTAL OSC / CLK Input Crystal Oscillator Interface or External Clock Source at
LVCMOS Levels
12 XTAL_OUT XTAL OSC Output Crystal Oscillator Interface
13 CLK0 Diff / SE Input Pulldown Non-inverting clock/data input 0.
14 CLK0 Diff / SE Input Pullup /
Pulldown
Inverting differential clock input 0.
27 CLK1 Diff / SE Input Pullup /
Pulldown
Inverting differential clock input 1
28 CLK1 Diff / SE Input Pulldown Non-inverting clock/data input 1
29 SEL1 LVCMOS / LVTTL
Input
Pulldown Input clock select. See Table 3 for function. Input Pulldown
30 SEL0 LVCMOS / LVTTL
Input
Pulldown Input clock select. See Table 3 for function. Input Pulldown
31 OE LVCMOS / LVTTL
Input
Pulldown Output Enable Control. See Table 4 for function.
EP The Exposed Pad (EP) on the QFN−32 package bottom is
thermally connected to the die for improved heat transfer out
of package. The exposed pad must be attached to a heat−
sinking conduit. The pad is electrically connected to the die,
and must be electrically connected to GND.
1. All VDD, VDDO
n
and GND pins must be externally connected to a power supply to guarantee proper operation. Bypass each V
DD
and VDDO
n
with 0.01 mF CAP to GND.
Table 2. PIN CHARACTERISTICS
Symbol Parameter Min Typ Max Unit
C
IN
Input Capacitance 4 pF
R Input Pulldown Resistor; Input Pulldown Resistor 50
kW
C
PD
Power Dissipation Capacitance (per output)
VDDO = 3.3 V
VDDO = 2.5 V
VDDO = 1.8 V
VDDO = 1.5 V
pF
R
OUT
Output Impedance
VDDO = 3.3 V
VDDO = 2.5 V
VDDO = 1.8 V
VDDO = 1.5 V
20
W

NB3F8L3010CMNR4G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 1:10 LVCMOS FANOUT BUFFER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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