NB3N1900K
www.onsemi.com
21
PACKAGE DIMENSIONS
QFN72 10x10, 0.5P
CASE 485DK
ISSUE O
SEATING
0.15 C
(A3)
A
A1
b
1
72
72X
L
72X
BOTTOM VIEW
TOP VIEW
SIDE VIEW
D
A B
E
0.15
C
PIN ONE
LOCATION
0.10 C
0.08 C
C
e
A0.10 B
C
0.05
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 10.00 BSC
D2 5.85 6.15
E 10.00 BSC
6.15E2 5.85
e 0.50 BSC
L 0.30 0.50
PLANE
SOLDERING FOOTPRINT*
L1 0.00 0.15
NOTE 4
E2
D2
NOTE 3
DETAIL B
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
DETAIL A
DIMENSIONS: MILLIMETERS
10.30
6.25
6.25
0.50
0.63
0.32
72X
72X
PITCH
10.30
PKG
OUTLINE
RECOMMENDED
1
A
M
0.10 BC
A
M
0.10 BC
M
M
19
55
36
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NB3N1900K/D
Intel is a registered trademark of Intel Corporation.
PCIe and PCI−SIG are registered trademarks of PCI−SIG.
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