WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.
Note 2: Limits at -40°C are guaranteed by design and not production tested.
Note 3: All voltages are referenced to ground.
Note 4: I
CCA
—SCL clocking at max frequency = 400kHz.
Note 5: Current is the averaged input current, which includes the temperature conversion current.
Note 6: The RST pin has an internal 50kΩ (nominal) pullup resistor to V
CC
.
Note 7: After this period, the first clock pulse is generated.
Note 8: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V
IH(MIN)
of the SCL signal)
to bridge the undefined region of the falling edge of SCL.
Note 9: The maximum t
HD:DAT
needs only to be met if the device does not stretch the low period (t
LOW
) of the SCL signal.
Note 10: A fast-mode device can be used in a standard-mode system, but the requirement t
SU:DAT
≥ 250ns must then be met. This
is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the
low period of the SCL signal, it must output the next data bit to the SDA line t
R(MAX)
+
t
SU:DAT
= 1000 + 250 = 1250ns
before the SCL line is released.
Note 11: C
B
—total capacitance of one bus line in pF.
Note 12: The parameter t
OSF
is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of
0.0V ≤ V
CC
≤ V
CC(MAX)
and 2.3V ≤ V
BAT
≤ 3.4V.
Note 13: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, t
REC
is bypassed and RST immedi-
ately goes high. The state of RST does not affect the I
2
C interface, RTC, or TCXO.