CY28416
Document #: 38-07657 Rev. *C Page 7 of 15
Crystal Recommendations
The CY28416 requires a Parallel Resonance Crystal.
Substituting a series resonance crystal will cause the
CY28416 to operate at the wrong frequency and violate the
ppm specification. For most applications there is a 300-ppm
frequency shift between series and parallel crystals due to
incorrect loading.
Crystal Loading
Crystal loading plays a critical role in achieving low ppm perfor-
mance. To realize low ppm performance, the total capacitance
the crystal will see must be considered to calculate the appro-
priate capacitive loading (CL).
Figure 1 shows a typical crystal configuration using the two
trim capacitors. An important clarification for the following
discussion is that the trim capacitors are in series with the
crystal, not parallel. It’s a common misconception that load
capacitors are in parallel with the crystal and should be
approximately equal to the load capacitance of the crystal.
This is not true.
.
Calculating Load Capacitors
In addition to the standard external trim capacitors, trace
capacitance and pin capacitance must also be considered to
correctly calculate crystal loading. As mentioned previously,
the capacitance on each side of the crystal is in series with the
crystal. This means the total capacitance on each side of the
crystal must be twice the specified crystal load capacitance
(CL). While the capacitance on each side of the crystal is in
series with the crystal, trim capacitors (Ce1,Ce2) should be
calculated to provide equal capacitive loading on both sides.
Use the following formulas to calculate the trim capacitor
values for Ce1 and Ce2.
CL....................................................Crystal load capacitance
CLe......................................... Actual loading seen by crystal
using standard value trim capacitors
Ce.....................................................External trim capacitors
Cs ..............................................Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
Byte 7: Vendor ID
Bit @Pup Name Description
7 0 Revision Code Bit 3 Revision Code Bit 3
6 0 Revision Code Bit 2 Revision Code Bit 2
5 0 Revision Code Bit 1 Revision Code Bit 1
4 1 Revision Code Bit 0 Revision Code Bit 0
3 1 Vendor ID Bit 3 Vendor ID Bit 3
2 0 Vendor ID Bit 2 Vendor ID Bit 2
1 0 Vendor ID Bit 1 Vendor ID Bit 1
0 0 Vendor ID Bit 0 Vendor ID Bit 0
Table 5. Crystal Recommendations
Frequency
(Fund) Cut Loading Load Cap
Drive
(max.)
Shunt Cap
(max.)
Motional
(max.)
Tolerance
(max.)
Stability
(max.)
Aging
(max.)
14.31818 MHz AT Parallel 20 pF 0.1 mW 5 pF 0.016 pF 50 ppm 50 ppm 5 ppm
Figure 1. Crystal Capacitive Clarification
XTAL
Ce2
Ce1
Cs1
Cs2
X1
X2
Ci1
Ci2
Clock Chip
Trace
2.8pF
Trim
33pF
Pin
3 to 6p
Figure 2. Crystal Loading Example
Load Capacitance (each side)
Total Capacitance (as seen by the crystal)
Ce = 2 * CL – (Cs + Ci)
Ce1 + Cs1 + Ci1
1
+
Ce2 + Cs2 + Ci2
1
(
)
1
=
CLe
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CY28416
Document #: 38-07657 Rev. *C Page 8 of 15
PD (Power-down) Clarification
The VTT_PWRGD# /PD pin is a dual-function pin. During
initial power-up, the pin functions as VTT_PWRGD#. Once
VTT_PWRGD# has been sampled LOW by the clock chip, the
pin assumes PD functionality. The PD pin is an asynchronous
active HIGH input used to shut off all clocks cleanly prior to
shutting off power to the device. This signal needs to be
synchronized internal to the device prior to powering down the
clock synthesizer. PD is also an asynchronous input for
powering up the system. When PD is asserted HIGH, all clocks
need to be driven to a LOW value and held prior to turning off
the VCOs and the crystal oscillator.
PD (Power-down) Assertion
When PD is sampled HIGH by two consecutive rising edges
of CPUC, all single-ended outputs must be held LOW on their
next HIGH-to-LOW transition and differential clocks must held
high or tri-stated (depending on the state of the control register
drive mode bit) on the next diff clock# HIGH-to-LOW transition.
When the SMBus PD drive mode bit corresponding to the
differential (CPU, SRC, and DOT) clock output of interest is
programmed to ‘0’, the clock output must be held with “Diff
clock” pin driven high at 2 x Iref, and “Diff clock#” tri-state. If
the control register PD drive mode bit corresponding to the
output of interest is programmed to “1”, then both the “Diff
clock” and the “Diff clock#” are tri-state. Note the example in
Figure 3 shows CPUT = 133 MHz and PD drive mode = ‘1’ for
all differential outputs. This diagram and description is appli-
cable to valid CPU frequencies 100, 133, 166, 200, 266, 333,
and 400 MHz. In the event that PD mode is desired as the
initial power-on state, PD must be asserted high in less than
10 µs after asserting VTT_PWRGD#.
PD Deassertion
The power-up latency needs to be less than 1.8 ms. This is the
time from the deassertion of the PD pin or the ramping of the
power supply until the time that stable clocks are output from
the clock chip. All differential outputs stopped in a tri-state
condition resulting from power down must be driven high in
less than 300 µs of PD deassertion to a voltage greater than
200 mV. After the clock chip’s internal PLL is powered up and
locked, all outputs are to be enabled within a few clock cycles
of each other. Figure 4 is an example showing the relationship
of clocks coming up. Unfortunately, we can not show all
possible combinations, designers need to insure that from the
first active clock output to the last takes no more than two full
PCI clock cycles.
Figure 3. Power-down Assertion Timing Waveform
PD
USB, 48MHz
DOT96T
DOT96C
SRCT 100MHz
SRCC 100MHz
CPUT, 133MHz
PCI, 33 MHz
REF
CPUC, 133MHz
[+] Feedback
CY28416
Document #: 38-07657 Rev. *C Page 9 of 15
Figure 4. Power-down Deassertion Timing Waveform
DOT96C
PD
CPUC, 133MHz
CPUT, 133MHz
SRCC 100MHz
USB, 48MHz
DOT96T
SRCT 100MHz
Tstable
<1.8 ms
PCI, 33MHz
REF
Tdrive_PWRDN#
<300µS, >200mV
FS_A, FS_B,FS_C
VTT_PWRGD#
PWRGD_VRM
VDD Clock Gen
Clock State
Clock Outputs
Clock VCO
0.2-0.3mS
Delay
State 0
State 2 State 3
Wait for
VTT_PWRGD#
Sample Sels
Off
Off
On
On
State 1
Device is not affected,
VTT_PWRGD# is ignored
Figure 5. VTT_PWRGD# Timing DiagramFigure 5. VTT_PWRGD# Timing Diagram
VTT_PWRGD# = Low
Delay >0.25 m s
S1
Power Off
S0
VDD_A = 2.0V
Sample
Inputs straps
S2
Normal
Operation
W ait for <1.8ms
Enable Outputs
S3
VTT_PWRGD# = toggle
VDD_A = off
Figure 6. Clock Generator Power-up/Run State Diagram
[+] Feedback

CY28416OXCT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC CLK GEN CPU 266MHZ 2CIRC 48SS
Lifecycle:
New from this manufacturer.
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