SI5424DC-T1-GE3

Vishay Siliconix
Si5424DC
Document Number: 73776
S13-0297-Rev. C, 11-Feb-13
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
N-Channel 30 V (D-S) MOSFET
FEATURES
TrenchFET
®
Power MOSFET
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Load Switch
- Notebook PC
Notes:
a. Package limited.
b. Surface mounted on 1” x 1” FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257
). The ChipFET 1206-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()
I
D
(A)
a
Q
g
(Typ.)
30
0.024 at V
GS
= 10 V
6
11 nC
0.030 at V
GS
= 4.5 V
6
Ordering Information:
Si5424DC-T1-GE3 (Lead (Pb)-free and Halogen-free)
ChipFET 1206-8
D
D
D
G
D
D
D
S
1
Bottom View
Marking Code
AF XXX
Lot Traceability
and Date Code
Part # Code
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 25
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
6
a
A
T
C
= 70 °C
6
a
T
A
= 25 °C
6
a
T
A
= 70 °C
6
a
Pulsed Drain Current
I
DM
40
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
5.2
a
T
A
= 25 °C
2.1
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
16
Avalanche Energy
E
AS
12.8 mJ
Maximum Power Dissipation
a
T
C
= 25 °C
P
D
6.25
W
T
C
= 70 °C
4
T
A
= 25 °C
2.5
b, c
T
A
= 70 °C
1.6
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 5 s
R
thJA
40 50
°C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
15 20
Vishay Siliconix
Si5424DC
www.vishay.com
2
Document Number: 73776
S13-0297-Rev. C, 11-Feb-13
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
19.4
mV/°C
V
GS(th)
Temperature Coefficient
V
GS(th)
/T
J
- 4.6
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.1 2.3 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 25 V
± 100 ns
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
40 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
10 V, I
D
= 4.8 A
0.020 0.024
V
GS
4.5 V, I
D
= 4.22 A
0.024 0.030
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 4.8 A
17 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
950
pFOutput Capacitance
C
oss
230
Reverse Transfer Capacitance
C
rss
180
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 4.8 A
21 32
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 4.8 A
11 17
Gate-Source Charge
Q
gs
3.2
Gate-Drain Charge
Q
gd
4.2
Gate Resistance
R
g
f = 1 MHz 2.2
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 2.63
I
D
5.7 A, V
GEN
= 4.5 V, R
g
= 1
17 26
ns
Rise Time
t
r
75 113
Turn-Off Delay Time
t
d(off)
22 33
Fall Time
t
f
12 18
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 2.5
I
D
6 A, V
GEN
= 10 V, R
g
= 1
10 15
Rise Time
t
r
38 57
Turn-Off Delay Time
t
d(off)
26 40
Fall Time
t
f
914
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
6
A
Pulse Diode Forward Current
I
SM
40
Body Diode Voltage
V
SD
I
S
= 4.3 A, V
GS
= 0 V
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 4.3 A, dI/dt = 100 A/µs,
T
J
= 25 °C
24 36 ns
Body Diode Reverse Recovery Charge
Q
rr
11 17 nC
Reverse Recovery Fall Time
t
a
9
ns
Reverse Recovery Rise Time
t
b
15
Vishay Siliconix
Si5424DC
Document Number: 73776
S13-0297-Rev. C, 11-Feb-13
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
10
20
30
40
0.0 0.6 1.2 1.8 2.4 3.0
V
GS
= 3 V
V
GS
= 2 V
V
GS
= 4 V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
= 10 thru 5 V
0.01
0.02
0.03
0.04
0 8 16 24 32 40
V
GS
= 10 V
V
GS
= 4.5 V
- On-Resistance (mΩ)R
DS(on)
I
D
- Drain Current (A)
0
2
4
6
8
10
0 6 12 18 24
V
DS
= 15 V
V
DS
= 24 V
I
D
= 6 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
0.0 0.6 1.2 1.8 2.4 3.0
T
J
= 25 °C
T
J
= 125 °C
T
J
= - 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
C
oss
C
rss
0
300
600
900
1200
1500
0 5 10 15 20 25 30
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 10 V, I
D
= 4.8 A
V
GS
= 4.5 V,
I
D
= 4.2 A
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)

SI5424DC-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V Vds 25V Vgs 1206-8 ChipFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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