LNJ424C46RA
Total pages Page
Product Specification
13 7
Outline
2011-04-05
Established Revised
Semiconductor Company, Panasonic Corporation
1
2
Anode
Cathode
3.5±0.2
3.2
φ2.4
C0.8
0.5
0.85
1.8±0.2
Max 0.00
Max 0.1
2.2
2.8±0.2
0.8±0.2
0.8±0.2
2.6
4.5
(1.5)
1.5 (1.5)
1
4
05
A
1
2
1
2
Polarity
Unit:mm
(Note1) Tolerance unless specified:±0.1 mm.
(Note2) ( ) A size is a reference.
Recommended Land Layout
05
Reserve
Day Lot No. (A
B
C
・・・
)
Day (01
02
03
・・・
)
Month(1
9,O,N,D)
Year (0
9)
1. Anode
2. Cathode
Marking Position
Amount of resin
Marking Specification
LNJ424C46RA
Total pages Page
Product Specification
13 8
Recommended Soldering Conditions
1. The reflow soldering
1) The first time reflow soldering
Pleasa use it on condition that the folloeing.
2) The second time reflow soldering (Up to the 2nd time)
In case of the second time reflow, please store the product 10 ℃~30 ℃,60 %RH and proceed
the reflow soldering within 3 days after the first time reflow.
Follow the same condition as the first reflow.
2. Hand soldering
1) Basically keep the temperature on the edge of iron at 350 and apply within 3 s.
If the temperature is higher than the condition above, apply in a shorter time (1 s per 10 ).
2) The iron equipped with temperature control circuit should be used.
3) Do not give a stress to lead or resin on soldering.
Especially do not let iron contact with them.
A LED chip will be damaged and broken by extreme stress.
4) Do not also give a stress to the device and bend of PC board adjusted right after manual
soldering iron.
5) The LED which was removed from PC board should not be used again.
6) Please do not solder excluding the reflow soldering or the manual soldering Iron.
2011-04-05
Established Revised
Semiconductor Company, Panasonic Corporation
Rate1 /s 5 /s
150 ℃~ 180
120 s
Max 70 s
200
Max. 260
Preheating
250
Max.10 s
40
30 s
This should be a profile on the print wiring board and FPC surface.
LNJ424C46RA
Total pages Page
Product Specification
13 9
3. Automatic Mounting
These products are available for automatic mounting machines.
However, concerning demand on structure and performance of these devices, you should pay
attentions to the followings below.
1) Though we’ve performed anti-static operation on these devices, static electricity can be
frequently occurred in dry atmosphere and cause products to stick on the cover tapes.
Please study to control humidity and to perform anti-static measure.
2) If a successful mounting is not secured on your systems, you may study the following subjects.
Inside diameter of tool
Especially for a round shaped tool, please choose the one not
sticking out from the LED’s lens area.
Shape of tool
For a particular tool (“asterisk” type etc.), which intends to
incline due to its shape.
Please study the location and the size of it.
Height of tool
Please set the height of the tool a little lower from top of the
face of tape guide.
Position in absorption
Please adjust the absorb position as a center of device as
possible.
Vibration in mounting
To reduce the vibration on mounting, please discuss taking
necessary measures against optimization of mounting speed
and tensions in winding and feeding tapes.
Pin push up system
Mind the pin position of the products prepared a pin-hole
(byφ0.5 mm) on the bottom of the embossed tape.
“Pin push up system” is suitable only for products with a
pin-hole but not for others.
2011-04-05
Established Revised
Semiconductor Company, Panasonic Corporation

LNJ424C46RA

Mfr. #:
Manufacturer:
Panasonic
Description:
Standard LEDs - SMD TOPLED AMBER 230MCD 589NM CLR 2PLCC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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