Device Ordering
Code
Device Package Junction
Temperature Range
Speed Grade
EP4CE40U19A7N EP4CE40 484-pin UBGA –40°C to 125°C –7
EP4CE55F23A7N EP4CE55 484-pin FBGA –40°C to 125°C –7
EP4CGX15BF14A7N EP4CGX15 169-pin FBGA –40°C to 125°C –7
2.6.2. Package Options and Maximum User I/Os
Table 15. Package Options and Maximum User I/Os in Cyclone IV E Devices
Package
Type/ Pin
Count
Ball
Spacing
(mm)
Dimensio
ns (mm)
Product Line
EP4CE6
(6.3K
LEs)
EP4CE10
(10.3K
LEs)
EP4CE15
(15.4K
LEs)
EP4CE22
(22.3K
LEs)
EP4CE30
(28.8K
LEs)
EP4CE40
(39.6K
LEs)
EP4CE55
(55.9K
LEs)
I/Os
EQFP-144 0.5 22 x 22 91 91 79
UBGA-25
6
0.8 14 x 14 165 153
FBGA-256 1 17 x 17 179 179 165 153
UBGA-48
4
0.8 19 x 19 328
FBGA-324 1 19 x 19 193 193
FBGA-484 1 23 x 23 343 328 328 324
Table 16. Package Options and Maximum User I/Os in Cyclone IV GX Devices
Package Type/ Pin Count Ball Spacing (mm) Dimensions (mm) Product Line
EP4CGX15 (14.4K LEs)
I/Os
FBGA-169 1 14 x 14 72 / 2
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2.6.3. Device Ordering Codes
Figure 7. Automotive-Grade Ordering Information for Cyclone IV E Devices
Family Signature
Package Type
Package Code
Operating Temperature
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
E : Enhanced logic/memory
EP4C : Cyclone® IV
6 : 6,272 logic elements
10 : 10,320 logic elements
15 : 15,408 logic elements
22 : 22,320 logic elements
30 : 28,848 logic elements
40 : 39,600 logic elements
55 : 55,856 logic elements
F : FineLine BGA (FBGA)
E : Enhanced Thin Quad Flat Pack (EQFP)
U : Ultra FineLine BGA (UBGA)
FBGA Package Type
17 : 256 pins
19 : 324 pins
23 : 484 pins
EQFP Package Type
22 : 144 pins
UBGA Package Type
14 : 256 pins
19 : 484 pins
A : Automotive temperature (T
J
= -40° C to 125° C)
7
N : Lead-free packaging
EP4C
E 40
F 23
A
7
N
Member Code
Family Variant
Figure 8. Automotive-Grade Ordering Information for Cyclone IV GX Devices
Family Signature
Transceiver Count
Package Type
Package Code
Operating Temperature
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
GX : 3-Gbps transceivers
EP4C : Cyclone® IV
15 : 14,400 logic elements
B : 2
F : FineLine BGA (FBGA)
FBGA Package Type
14 : 169 pins
A : Automotive temperature (T
J
= -40° C to 125° C)
7
N : Lead-free packaging
EP4C
GX 15 B
F 14
A
7
N
Member Code
Family Variant
2.7. MAX V Devices
2.7.1. Supported Automotive-Grade Devices
Table 17. Automotive-Grade in MAX V Devices
Other automotive-grade product line/package combinations or ordering codes might be available upon request.
Consult your Intel sales representative to submit your request.
Device Ordering
Code
Device Package Junction
Temperature Range
Speed Grade
5M40ZE64A5N 5M40Z 64-pin EQFP –40°C to 125°C –5
5M80ZE64A5N 5M80Z 64-pin EQFP –40°C to 125°C –5
5M80ZT100A5N 5M80Z 100-pin TQFP –40°C to 125°C –5
continued...
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Device Ordering
Code
Device Package Junction
Temperature Range
Speed Grade
5M160ZE64A5N 5M160Z 64-pin EQFP –40°C to 125°C –5
5M160ZT100A5N 5M160Z 100-pin TQFP –40°C to 125°C –5
5M240ZT100A5N 5M240Z 100-pin TQFP –40°C to 125°C –5
5M570ZT100A5N 5M570Z 100-pin TQFP –40°C to 125°C –5
5M1270ZF256A5N 5M1270Z 256-pin FBGA –40°C to 125°C –5
5M1270ZT144A5N 5M1270Z 144-pin TQFP –40°C to 125°C –5
2.7.2. Package Options and Maximum User I/Os
Table 18. Package Options and Maximum User I/Os in MAX V Devices
Package
Type/ Pin
Count
Ball
Spacing
(mm)
Dimension
s (mm)
Product Line
5M40Z
(40K LEs)
5M80Z
(80K LEs)
5M160Z
(160K LEs)
5M240Z
(240K LEs)
5M570Z
(570K LEs)
5M1270Z
(1270K
LEs)
I/Os
EQFP-64 0.5 7 x 7 54 54 54
TQFP-100 0.5 14 x 14 79 79 79 74
TQFP-144 0.5 20 x 20 114
FBGA-256 1 17 x 17 211
2.7.3. Device Ordering Codes
Figure 9. Automotive-Grade Ordering Information for MAX V Devices
Package Type
T: Thin quad flat pack (TQFP)
F: FineLine BGA (FBGA)
E: Plastic Enhanced Quad Flat Pack (EQFP)
Speed Grade
Family Signature
5M: MAX® V
Operating Temperature
Pin Count
Device Type
40Z: 40 Logic Elements
80Z: 80 Logic Elements
160Z: 160 Logic Elements
240Z: 240 Logic Elements
570Z: 570 Logic Elements
1270Z: 1,270 Logic Elements
Optional Suffix
5
Number of pins for a particular package
5M 40Z E 64 A 5 N
A: Automotive temperature
(T
J
= -40° C to 125° C)
Indicates specific device
options or shipment method
N:Lead-free packaging
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5CSEBA2U23A7N

Mfr. #:
Manufacturer:
Intel / Altera
Description:
FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union