ADM1021A
Rev. 7 | Page 16 of 19 | www.onsemi.com
APPLICATIONS INFORMATION
FACTORS AFFECTING ACCURACY
Remote Sensing Diode
The ADM1021A is designed to work with substrate transistors
built into processors, or with discrete transistors. Substrate
transistors are generally PNP types with the collector connected
to the substrate. Discrete types can be either PNP or NPN,
connected as a diode (base shorted to collector). If an NPN
transistor is used, the collector and base are connected to D+
and the emitter to D−. If a PNP transistor is used, the collector
and base are connected to D− and the emitter to D+.
The user has no choice in the case of substrate transistors, but
if a discrete transistor is used, the best accuracy is obtained by
choosing devices according to the following criteria:
1.
Base-emitter voltage greater than 0.25 V at 6 μA, at the
highest operating temperature.
2.
Base-emitter voltage less than 0.95 V at 100 μA, at the
lowest operating temperature.
3.
Base resistance less than 100 Ω.
4.
Small variation in h
FE
(such as 50 to 150), which indicates
tight control of V
BE
characteristics.
Transistors, such as 2N3904, 2N3906, or equivalents, in SOT-23
package are suitable devices to use.
Thermal Inertia and Self-Heating
Accuracy depends on the temperature of the remote-sensing
diode and/or the internal temperature sensor being at the same
temperature as that being measured, and a number of factors
can affect this. Ideally, the sensor should be in good thermal
contact with the part of the system being measured, for example
the processor. If it is not, the thermal inertia caused by the mass
of the sensor causes a lag in the response of the sensor to a
temperature change. For the remote sensor, this should not be a
problem, because it is either a substrate transistor in the
processor or a small package device, such as SOT-23, placed in
close proximity to it.
The on-chip sensor is, however, often remote from the proc-
essor and only monitors the general ambient temperature
around the package. The thermal time constant
of the QSOP-16 package is approximately 10 seconds.
In practice, the package will have an electrical, and hence a
thermal, connection to the printed circuit board, so the
temperature rise due to self-heating is negligible.
ADM1021A
Rev. 7 | Page 17 of 19 | www.onsemi.com
LAYOUT CONSIDERATIONS
Digital boards can be electrically noisy environments, and
because the ADM1021A is measuring very small voltages from
the remote sensor, care must be taken to minimize noise
induced at the sensor inputs. The following precautions should
be taken:
1.
Place the ADM1021A as close as possible to the remote
sensing diode. Provided that the worst noise sources, such
as clock generators, data/address buses, and CRTs, are
avoided, this distance can be four to eight inches.
2.
Route the D+ and D− tracks close together, in parallel,
with grounded guard tracks on each side. Provide a
ground plane under the tracks, if possible.
3.
Use wide tracks to minimize inductance and reduce noise
pickup. 10 mil track minimum width and spacing is
recommended.
4.
Try to minimize the number of copper/solder joints,
which can cause thermocouple effects. Where
copper/solder joints are used, ensure they are in both the
D+ and D− paths and at the same temperature.
Thermocouple effects should not be a major problem as
1°C corresponds to about 240 μV, and thermocouple
voltages are about 3 μV/°C of temperature difference.
Unless there are two thermocouples with a big tempera-
ture differential between them, thermocouple voltages
should be much less than 240 μV.
5.
Place a 0.1 μF bypass capacitor close to the V
DD
pin, and
2200 pF input filter capacitors across D+, D− close to the
ADM1021A.
6.
If the distance to the remote sensor is more than eight
inches, the use of twisted pair cable is recommended. This
works up to about 6 to 12 feet.
7.
For very long distances (up to 100 feet), use shielded
twisted pair, such as Belden #8451 microphone cable.
Connect the twisted pair to D+ and D− and the shield to
GND close to the ADM1021A. Leave the remote end of
the shield unconnected to avoid ground loops.
00056-019
GND
D+
D–
GND
10 MIL
10 MIL
10 MIL
10 MIL
10 MIL
10 MIL
10 MIL
Figure 19. Arrangement of Signal Tracks
Because the measurement technique uses switched current
sources, excessive cable and/or filter capacitance can affect the
measurement. When using long cables, the filter capacitor can
be reduced or removed.
Cable resistance can also introduce errors. A series resistance
of 1 Ω introduces about 1°C error.
ADM1021A
Rev. 7 | Page 18 of 19 | www.onsemi.com
APPLICATION CIRCUITS
Figure 20 shows a typical application circuit for the ADM1021A,
using a discrete sensor transistor connected via a shielded,
twisted pair cable. The pull-ups on SCLK, SDATA, and
ALERT
are required only if they are not already provided elsewhere in
the system.
The SCLK and SDATA pins of the ADM1021A can be inter-
faced directly to the SMBus of an I/O chip. Figure 21 shows how
the ADM1021A might be integrated into a system using this
type of I/O controller.
00056-020
V
DD
STBY
SCLK
SDATA
ALERT
ADD0
ADD1
GND
D+
D–
0.1
μ
F
ALL 10k
Ω
3.3V
TO CONTROL
CHIP
SET TO REQUIRED
ADDRESS
IN
OUT
I/O
C1*
SHIELD
2N3904
* C1 IS OPTIONAL
ADM1021A
Figure 20. Typical Application Circuit
00056-021
USB
PROCESSOR
DISPLAY
SYSTEM BUS
DISPLAY
CACHE
SYSTEM
MEMORY
GMCH
FWH
(FIRMWARE HUB)
ADM1021A
D– D+
ALERT
SCLK
SDATA
SUPER
I/O
SMBus
PCI BUS
PCI SLOTS
2 USB PORTS
C
D-ROM
HARD
DISK
2 IDE PORTS
ICH
I/O CONTROLLER
HUB
USB
Figure 21. Typical System Using ADM1021A

EVAL-ADM1021AEB

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
BOARD EVAL FOR ADM1021
Lifecycle:
New from this manufacturer.
Delivery:
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