13
AT24C1024
1471I–SEEPR–7/03
Note: For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.
Ordering Information
Ordering Code
Package Operation Range
AT24C1024-10CI-2.7
AT24C1024C1-10CI-2.7
AT24C1024-10PI-2.7
AT24C1024W-10SI-2.7
AT24C1024-10UI-2.7
8CN3
8CN1
8P3
8S2
8U8
Industrial
(-40°C to 85°C)
Package Type
8CN3 8-lead, 0.230" Wide, Leadless Array Package (LAP)
8CN1 8-lead, 0.300" Wide, Leadless Array Package (LAP)
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8U8 8-ball, die Ball Grid Array Package (dBGA)
Options
-2.7 Low Voltage (2.7V to 5.5V)
14
AT24C1024
1471I–SEEPR–7/03
Packaging Information
8CN3 – LAP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8CN3, 8-lead, (6 x 5 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
A
8CN3
11/14/01
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.94 1.04 1.14
A1 0.30 0.34 0.38
b 0.36 0.41 0.46 1
D 5.89 5.99 6.09
E 4.83 4.93 5.03
e 1.27 BSC
e1 0.56 REF
L 0.62 0.67 0.72 1
L1 0.92 0.97 1.02 1
Note: 1. Metal Pad Dimensions.
15
AT24C1024
1471I–SEEPR–7/03
8CN1 – LAP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8CN1, 8-lead (8 x 5 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
A
8CN1
11/13/01
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.94 1.04 1.14
A1 0.30 0.34 0.38
b 0.36 0.41 0.46 1
D 7.90 8.00 8.10
E 4.90 5.00 5.10
e 1.27 BSC
e1 0.60 REF
L 0.62 0.67 0.72 1
L1 0.92 0.97 1.02 1
Note: 1. Metal Pad Dimensions.

AT24C1024W-10SI-2.7-T

Mfr. #:
Manufacturer:
Description:
IC EEPROM 1M I2C 1MHZ 8SOIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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