16
AT24C1024
1471I–SEEPR–7/03
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
17
AT24C1024
1471I–SEEPR–7/03
8S2 – EIAJ SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
5/2/02
8S2
B
Top View
Side View
End View
H
1
N
C
E
A
b
L
A1
e
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs aren't included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Values b,C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/-0.005 mm.
A 1.78 2.03
A1 0.05 0.33
b 0.35 0.51 5
C 0.18 0.25 5
D 5.13 5.38
E 5.13 5.41 2, 3
H 7.62 8.38
L 0.51 0.89
e 1.27 BSC 4
18
AT24C1024
1471I–SEEPR–7/03
8U8 – dBGA
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8U8, 8-ball 0.75 pitch, Die Ball Grid Array
Package (dBGA) AT24C1024 (AT35520)
01/09/02
8U8
A
d
e
Bottom View
Side View
Top View
D
E
A2
A
4
3
2
1
8
7
6
5
E1
D1
A1
-
Z
-
ZM80.0
YXZM51.0
Øb
#
#
#
#
Pin 1 Mark
this corner
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 3.84
D1 0.80 TYP
E 2.85
E1 1.05 TYP
e 0.75 TYP
d 0.75 TYP
A 0.90 REF
A1 0.49 0.52 0.55
A2 0.35 0.38 0.41
Ø
b 0.47 0.50 0.53
Notes: 1. This drawing is for general information only. No JEDEC Drawing to refer to for additional information.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum Z.

AT24C1024W-10SI-2.7-T

Mfr. #:
Manufacturer:
Description:
IC EEPROM 1M I2C 1MHZ 8SOIC
Lifecycle:
New from this manufacturer.
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