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SST12LP08-QXBE

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
PROPRIETARY AND
CONFIDENTIAL
©2012 Silicon Storage Technology, Inc. DS75073B 06/12
16
2.4 GHz High-Power, High-Gain Power Amplifier
SST12LP08
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 15:12-Contact Extremely-thin Quad Flat No-lead (XQFN)
SST Package Code: QXB
Note: 1. Complies with JEDEC JEP95 MO-220J, variant VEED-4 except external paddle nominal dimensions and pull-back of terminals
from body edge.
2. The topside pin 1 indicator is laser engraved; its approximate shape and location is as shown.
3. From the bottom view, the pin 1 indicator may be either a curved indent or a 45-degree chamfer.
3. The external paddle is electrically connected to the die back-side and possibly to certain V
SS
leads.
This paddle must be soldered to the PC board; it is required to connect this paddle to the V
SS
of the unit. Connection of this
paddle to any other voltage potential will result in shorts and electrical malfunction of the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
12-xqfn-2x2-QXB-2.0
0.4 BSC
See notes
2 and 3
Pin 1
0.25
0.15
0.92
0.05 Max
0.34
0.24
0.50
0.40
TOP VIEW
BOTTOM VIEW
SIDE VIEW
1mm
0.265
0.165
Pin 1
(laser
engraved
seenote2)
2.00
±0.05
2.00
±0.05
0.075
PROPRIETARY AND
CONFIDENTIAL
©2012 Silicon Storage Technology, Inc. DS75073B 06/12
17
2.4 GHz High-Power, High-Gain Power Amplifier
SST12LP08
Data Sheet
A
Microchip Technology Company
Figure 16:6-Contact Extremely-thin Quad Small Outline No-lead (XSON)
SST Package Code: QX6
TOP VIEW BOTTOM VIEWSIDE VIEW
0.50
0.40
0.75
Pin # 1
1.50
±0.10
Pin #1
(laser
engraved)
1.50
±0.10
0.50 BSC
0.20
0.20
6-xson-1.5x1.5-QX6-1.0
1mm
0.05 Max
0.70
See notes
2 and 3
1.20
Note:
1. Similar to JEDEC JEP95 XQFN/XSON variants, though number of contacts and some dimensions are different.
2. From the bottom view, the pin #1 indicator may be either a curved indent or a 45-degree chamfer.
3. The external paddle is electrically connected to the die back-side and to V
SS
.
This paddle must be soldered to the PC board; it is required to connect this paddle to the V
SS
of the unit.
Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
PROPRIETARY AND
CONFIDENTIAL
©2012 Silicon Storage Technology, Inc. DS75073B 06/12
18
2.4 GHz High-Power, High-Gain Power Amplifier
SST12LP08
Data Sheet
A
Microchip Technology Company
Table 6:Revision History
Revision Description Date
00
• Initial release of data sheet
Apr 2009
01
• Revised Figure 9 on page 11
May 2009
02
• Added information for Qx6 package.
• Revised Table 4
Aug 2009
03
• Updated “Electrical Specifications” and Table 4
Nov 2009
04
• Changed document status to “Data Sheet.”
Feb 2010
A
• Applied new document format
• Released document under letter revision system
• Updated Spec number from S71399 to DS75073
Mar 2012
B
• Updated Figure 15 on page 16 to reflect new Pin1 indicator
• Updated “Test Conditions” statement on page 9
Jun 2012
©
2012 Silicon Storage Technology, Inc–a Microchip Technology Company. All rights reserved.
SST, Silicon Storage Technology, the SST logo, SuperFlash, MTP, and FlashFlex are registered trademarks of Silicon Storage Tech-
nology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage Technology, Inc. All other trademarks and
registered trademarks mentioned herein are the property of their respective owners.
Specifications are subject to change without notice. Refer to www.microchip.com for the most recent documentation. For the most current
package drawings, please see the Packaging Specification located at http://www.microchip.com/packaging.
Memory sizes denote raw storage capacity; actual usable capacity may be less.
SST makes no warranty for the use of its products other than those expressly contained in the Standard Terms and Conditions of
Sale.
For sales office locations and information, please see www.microchip.com.
Silicon Storage Technology, Inc.
A Microchip Technology Company
www.microchip.com
ISBN:978-1-62076-384-1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

SST12LP08-QXBE

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Manufacturer:
Microchip Technology
Description:
RF Amplifier 2.4-2.5GHz 3.3V 200mA ICC 802.11 b/g
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