2 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback November 25, 2014
IRF7946PbF
Notes:
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Used double sided cooling , mounting pad with large heatsink.
T
C
measured with thermocouple mounted to top (Drain) of part.
Surface mounted on 1 in. square Cu
(still air).
Mounted to a PCB with
small clip heatsink (still air)
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
Absolute Maximum Ratings
Symbol Parameter Units
I
@ T
= 25°C Continuous Drain Current, V
@ 10V (Silicon Limited)
I
@ T
= 100°C Continuous Drain Current, V
@ 10V (Silicon Limited)
I
Pulsed Drain Current
P
@T
= 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
V
Gate-to-Source Voltage
V
T
Operating Junction and
T
Storage Temperature Range
Avalanche Characteristics
E
Single Pulse Avalanche Energy
mJ
E
Single Pulse Avalanche Energy
I
Avalanche Current
A
E
Repetitive Avalanche Energy
mJ
Thermal Resistance
Symbol Parameter Typ. Max. Units
R
Junction-to-Ambient ––– 45
R
Junction-to-Ambient 12.5 –––
R
Junction-to-Ambient 20 ––– °C/W
R
Junction-to-Case
–––
1.3
R
Junction-to-PCB Mounted
1.0
–––
96
Max.
198
125
793
200
-55 to + 150
A
°C
85
See Fig. 14, 15, 22a, 22b
± 20
0.77
Static @ T
J
= 25°C (unless otherwise specified)
Symbol Parameter Min. Typ. Max. Units
V
Drain-to-Source Breakdown Voltage 40 ––– ––– V
V
/
T
Breakdown Voltage Temp. Coefficient ––– 0.03 ––– V/°C
R
Static Drain-to-Source On-Resistance ––– 1.1 1.4
mΩ
1.7 –––
mΩ
V
Gate Threshold Voltage 2.2 3.0 3.9 V
I
Drain-to-Source Leakage Current ––– ––– 1.0 μA
––– ––– 150
I
Gate-to-Source Forward Leakage ––– ––– 100 nA
Gate-to-Source Reverse Leakage ––– ––– -100
R
Internal Gate Resistance ––– 0.67 –––
V
= 20V
V
= -20V
V
= 40V, V
= 0V
V
= 40V, V
= 0V, T
= 125°C
V
= 6.0V, I
= 72A
Conditions
V
= 0V, I
= 250μA
Reference to 25°C, I
= 1.0mA
V
= 10V, I
= 90A
V
= V
, I
= 150μA