NCV7342
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8
ELECTRICAL CHARACTERISTICS
Definitions
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing
into the pin; sourcing current means the current is flowing out of the pin.
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Conditions Min Max Unit
V
SUP
Supply voltage V
CC
, V
IO
−0.3 +6 V
V
CANH
DC voltage at pin CANH 0 < V
CC
< 5.5 V; no time limit −50 +50 V
V
CANL
DC voltage at pin CANL 0 < V
CC
< 5.5 V; no time limit −50 +50 V
V
CANH,Lmax
DC voltage at pin CANH and CANL during load dump
condition
0 < V
CC
< 5.5 V; less than
one second
− 58 V
V
SPLIT
DC voltage at V
SPLIT
pin (On NCV7342−0 version only) 0 < V
CC
< 5.5 V; no time limit −50 +50 V
V
IO
DC voltage at pin TxD, RxD, STB −0.3 +6 V
V
esd
Electrostatic discharge voltage at all pins according to
EIA−JESD22
(Note 2) −4 +4 kV
Standardized charged device model ESD pulses
according to ESD−STM5.3.1−1999
−750 +750 V
Electrostatic discharge voltage at CANH,CANL, V
SPLIT
pins according to EIA−JESD22
(Note 2) −8 +8 kV
Electrostatic discharge voltage at CANH, CANL pins
According to IEC 61000−4−2
(Note 3) −15 +15 kV
V
schaff
Transient voltage at CANH, CANL pins, See Figure 6 (Note 4) −150 +100 V
Latch−up Static latch−up at all pins (Note 5)
150
mA
T
stg
Storage temperature −55 +150 °C
T
amb
Ambient temperature −40 +125 °C
T
J
Maximum junction temperature −40 +170 °C
MSL Moisture Sensitivity Level SOIC 2 −
MSL Moisture Sensitivity Level DFN 1 −
T
SLD
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 6)
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. Standardized human body model electrostatic discharge (ESD) pulses in accordance to EIA−JESD22. Equivalent to discharging a 100 pF
capacitor through a 1.5 kW resistor.
3. System human body model electrostatic discharge (ESD) pulses. Equivalent to discharging a 150 pF capacitor through a 330 W resistor
referenced to GND. Verified by external test house
4. Pulses 1, 2a,3a and 3b according to ISO 7637 part 3. Verification by external test house.
5. Static latch−up immunity: Static latch−up protection level when tested according to EIA/JESD78.
6. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 5. THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, SOIC−8 (Note 7)
Thermal Resistance, Junction−to−Air, Free air, 1S0P PCB (Note 8)
Thermal Resistance, Junction−to−Air, Free air, 2S2P PCB (Note 9)
R
q
JA
R
q
JA
125
75
°C/W
°C/W
Thermal Characteristics, DFN−8, 3x3 mm (Note 7)
Thermal Resistance, Junction−to−Air, Free air, 1S0P PCB (Note 8)
Thermal Resistance, Junction−to−Air, Free air, 2S2P PCB (Note 9)
R
q
JA
R
q
JA
140
47
°C/W
°C/W
7. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe
Operating parameters.
8. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage.
9. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage for the signal layer and
4 thermal vias connected between exposed pad and first inner Cu layer.