ADP3650
Rev. A | Page 12 of 12
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 16. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
90308-B
1
EXPOSED
PA D
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 17. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm x 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description
Package
Option
Ordering
Quantity
Branding
ADP3650JRZ −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 98
ADP3650JRZ-RL −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 2,500
ADP3650JCPZ-RL −40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 5,000 L91
1
Z = RoHS Compliant Part.
©2008–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07826-0-7/10(A)
