ADP3650
Rev. A | Page 3 of 12
SPECIFICATIONS
VCC = 12 V, BST = 4 V to 26 V, T
A
= −40°C to +85°C, unless otherwise noted.
1
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
DIGITAL INPUTS (IN, OD)
Input Voltage High 2.0 V
Input Voltage Low 0.8 V
Input Current −1 +1 μA
Hysteresis 40 250 350 mV
HIGH-SIDE DRIVER
Output Resistance, Sourcing Current BST − SW = 12 V; T
A
= 25°C 3.3 Ω
BST − SW = 12 V; T
A
= −40°C to +85°C 2.5 3.9 Ω
Output Resistance, Sinking Current BST − SW = 12 V; T
A
= 25°C 1.8 Ω
BST − SW = 12 V; T
A
= −40°C to +85°C 1.4 2.6 Ω
Output Resistance, Unbiased BST − SW = 0 V 10
Transition Times t
rDRVH
BST − SW = 12 V, C
LOAD
= 3 nF, see Figure 3 25 40 ns
t
fDRVH
BST − SW = 12 V, C
LOAD
= 3 nF, see Figure 3 20 30 ns
Propagation Delay Times t
pdhDRVH
BST − SW = 12 V, C
LOAD
= 3 nF, 32 45 70 ns
25°C T
A
≤ 85°C, see Figure 3
t
pdlDRVH
BST − SW = 12 V, C
LOAD
= 3 nF, see Figure 3 25 35 ns
OD
pdl
t
See Figure 2 20 35 ns
OD
pdh
t
See Figure 2 40 55 ns
SW Pull-Down Resistance SW to PGND 10
LOW-SIDE DRIVER
Output Resistance, Sourcing Current T
A
= 25°C 3.3 Ω
T
A
= −40°C to +85°C 2.4 3.9 Ω
Output Resistance, Sinking Current T
A
= 25°C 1.8 Ω
T
A
= −40°C to +85°C 1.4 2.6 Ω
Output Resistance, Unbiased VCC = PGND 10
Transition Times
t
rDRVL
C
LOAD
= 3 nF, see Figure 3 20 35 ns
t
fDRVL
C
LOAD
= 3 nF, see Figure 3 16 30 ns
Propagation Delay Times t
pdhDRVL
C
LOAD
= 3 nF, see Figure 3 12 35 ns
t
pdlDRVL
C
LOAD
= 3 nF, see Figure 3 30 45 ns
OD
pdl
t
See Figure 2 20 35 ns
OD
pdh
t
See Figure 2 110 190 ns
Timeout Delay SW = 5 V 110 190 ns
SW = PGND 95 150 ns
SUPPLY
Supply Voltage Range V
CC
4.15 13.2 V
Supply Current I
SYS
BST = 12 V, IN = 0 V 2 5 mA
UVLO Voltage V
CC
rising 1.5 3.0 V
Hysteresis 350 mV
1
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods.
ADP3650
Rev. A | Page 4 of 12
TIMING CHARACTERISTICS
Timing is referenced to the 90% and 10% points, unless otherwise noted.
t
pdlOD
90%
10%
OD
DRVH
OR
DRVL
t
pdhOD
0
7826-004
Figure 2. Output Disable Timing Diagram
IN
DRVH
TO
SW
DRVL
SW
V
TH
V
TH
1V
t
pdlDRVL
t
fDRVL
t
pdlDRVH
t
rDRVL
t
fDRVH
t
pdhDRVH
t
rDRVH
t
pdhDRVL
07826-005
Figure 3. Timing Diagram
ADP3650
Rev. A | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
All voltages are referenced to PGND, unless otherwise noted.
Table 2.
Parameter Rating
VCC −0.3 V to +15 V
BST
DC −0.3 V to VCC + 15 V
<200 ns −0.3 V to +35 V
BST to SW −0.3 V to +15 V
SW
DC −5 V to +15 V
<200 ns −10 V to +25 V
DRVH
DC SW − 0.3 V to BST + 0.3 V
<200 ns SW − 2 V to BST + 0.3 V
DRVL
DC −0.3 V to VCC + 0.3 V
<200 ns −2 V to VCC + 0.3 V
IN, OD
−0.3 V to +6.5 V
Operating Ambient Temperature Range −40°C to +85°C
Junction Temperature Range 0°C to 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature
Soldering (10 sec) 300°C
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
8-Lead SOIC_N (R-8)
2-Layer Board 123 °C/W
4-Layer Board 90 °C/W
8-Lead LFCSP_VD
1
(CP-8-2)
4-Layer Board 50 °C/W
1
For LFCSP_VD, θ
JA
is measured per JEDEC STD with exposed pad soldered to PCB.
ESD CAUTION

ADP3650JRZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Gate Drivers Dual Bootstrapped 12V MOSFET Dvr
Lifecycle:
New from this manufacturer.
Delivery:
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