DDR2 SDRAM SORDIMM
MT18HTS25672RHZ – 2GB
Features
•
200-pin, small-outline registered dual in-line memo-
ry module (SORDIMM)
•
Fast data transfer rates: PC2-4200, PC2-5300, or
PC2-6400
•
2GB (256 Meg x 72)
•
Supports ECC error detection and correction
•
V
DD
= 1.8V
•
V
DDSPD
= 3.0–3.6V
•
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
•
Differential data strobe (DQS, DQS#) option
•
4n-bit prefetch architecture
•
Multiple internal device banks for concurrent opera-
tion
•
Programmable CAS latency (CL)
•
Posted CAS additive latency (AL)
•
WRITE latency = READ latency - 1
t
CK
•
Programmable burst lengths (BL): 4 or 8
•
Adjustable data-output drive strength
•
64ms, 8192-cycle refresh
•
On-die termination (ODT)
•
Serial presence detect (SPD) with EEPROM
•
Phase-lock loop (PLL) to reduce system clock line
loading
•
Gold edge contacts
•
Dual rank, using 2Gb TwinDie™ devices
•
Halogen-free
•
Combination Temp Sensor/EEPROM
Figure 1: 200-Pin SORDIMM (R/C B)
Module height: 30mm (1.181 in)
Options Marking
•
Operating temperature
– Commercial (0°C ≤ T
A
≤ +70°C)
None
– Industrial (–40°C ≤ T
A
≤ +85°C)
1
I
•
Package
–
200-pin DIMM (Halogen-free) Z
•
Frequency/CL
2
–
2.5 @ CL = 5 (DDR2-800) -80E
–
2.5 @ CL = 6 (DDR2-800) -800
–
3.0ns @ CL = 5 (DDR2-667) -667
Notes:
1. Contact Micron for industrial temperature
module offerings
2. CL = CAS (READ) latency; registered mode
will add one clock cycle to CL.
Table 1: Key Timing Parameters
Speed
Grade
Industry
Nomenclature
Data Rate (MT/s) t
RCD
(ns)
t
RP
(ns)
t
RC
(ns)CL = 6 CL = 5 CL = 4 CL = 3
-80E PC2-6400 800 800 533 400 12.5 12.5 55
-800 PC2-6400 800 667 533 400 15 15 55
-667 PC2-5300
–
667 553 400 15 15 55
-53E PC2-4200
– –
553 400 15 15 55
-40E PC2-3200
– –
400 400 15 15 55
2GB (x72, ECC, DR) 200-Pin DDR2 SDRAM SORDIMM
Features
PDF: 09005aef83f287c1
hts18c256x72rhz.pdf - Rev. A 3/10 EN
1
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© 2010 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.