IDT8T49N008ANLGI REVISION A FEBRUARY 13, 2014 28 ©2014 Integrated Device Technology, Inc.
IDT8T49N008I Data Sheet PROGRAMMABLE FEMTOCLOCK
®
NG LVPECL/LVDS CLOCK GENERATOR WITH 8-OUTPUTS
Figure 9. IDT8T49N008I Application Schematic
C9
0.1uF
C17
0.1uF
VCC O
C7
0.1uF
VCC_38
VCC A
Q2_N
Q2_P
Q3_N
Q3_P
Q4_P
Q4_N
Q5_P
Q5_N
Q6_P
Q6_N
Zo = 50 Ohm
R9
82.5
R14
50
R15
50
Zo = 50 Ohm
+
-
Zo = 50 Ohm
R13
50
Optional Four Resist or
Thevinin Terminat ion
RU 2
Not Install
RU1
1K
RD 2
1K
VCC
RD1
Not Install
VCC
C6
0.1uF
C10
0.1uF
3.3V
C14
10uF
FB1
BLM18BB221SN 1
1 2
C16
10uF
3.3V
FB2
BLM18BB221SN 1
1 2
C19
0.1uF
To Logic
In pu t
pins
Logic Cont rol Input Examples
Set Logic
Input to '1'
Set Logic
Input to '0'
SCLK
SDA TA
3.3V
C21
10uF
3.3V
FB3
BLM18BB221SN1
1 2
C22
0.1uF
VCC O
VCC_19
VCC_38
Zo = 50 Ohm
R4 50
R5
50
Zo = 50 Ohm
R3 50
Q7_N
C8
10uF
R16
10
Q7_P
R1
4.7K
R2
4.7K
3.3V R6
330
Q1_N
Q0_N
Q0_P
Q1_P
C15
0.1uF
R10
82.5
R8
133
R7
133
+
-
Zo = 50 Ohm
C23
9pF
C18
9pF
X1
25MHz(12pf)
U1
VE E
37
VC C
38
CLK_SEL
39
VE E
40
Q0
1
nQ0
2
nQ1
4
Q1
3
VC CO
5
Q2
6
nQ2
7
Q3
8
nQ3
9
VE E
10
XTAL_IN
11
XTAL_OU T
12
nQ6
24
Q7
23
nQ7
22
VE E
21
FSEL1
20
VC C
19
VE E
18
AD DR _SE L
17
FSEL0
16
nCLK
15
CLK
14
VE E
13
LO CK
36
VC CA
35
VE E
34
SD ATA
33
SC LK
32
VE E
31
Q4
30
nQ4
29
Q5
28
nQ5
27
VC CO
26
Q6
25
epad
41
VC C_19
PECL Driv er
To Logic
Input
pin s
VCC A
CLK_SEL
FSEL0
FSEL1
ADD R _SE L
Fo r A C t er mination options consult the IDT Applications Note
"Ter mination - 3.3V L V PECL"
LOCK
IDT8T49N008ANLGI REVISION A FEBRUARY 13, 2014 29 ©2014 Integrated Device Technology, Inc.
IDT8T49N008I Data Sheet PROGRAMMABLE FEMTOCLOCK
®
NG LVPECL/LVDS CLOCK GENERATOR WITH 8-OUTPUTS
PCI Express Application Note
PCI Express jitter analysis methodology models the system
response to reference clock jitter. The block diagram below shows the
most frequently used Common Clock Architecture in which a copy of
the reference clock is provided to both ends of the PCI Express Link.
In the jitter analysis, the transmit (Tx) and receive (Rx) serdes PLLs
are modeled as well as the phase interpolator in the receiver. These
transfer functions are called H1, H2, and H3 respectively. The overall
system transfer function at the receiver is:
The jitter spectrum seen by the receiver is the result of applying this
system transfer function to the clock spectrum X(s) and is:
In order to generate time domain jitter numbers, an inverse Fourier
Transform is performed on X(s)*H3(s) * [H1(s) - H2(s)].
PCI Express Common Clock Architecture
For PCI Express Gen 1, one transfer function is defined and the
evaluation is performed over the entire spectrum: DC to Nyquist (e.g
for a 100MHz reference clock: 0Hz – 50MHz) and the jitter result is
reported in peak-peak.
PCIe Gen 1 Magnitude of Transfer Function
For PCI Express Gen 2, two transfer functions are defined with 2
evaluation ranges and the final jitter number is reported in RMS. The
two evaluation ranges for PCI Express Gen 2 are 10kHz – 1.5MHz
(Low Band) and 1.5MHz – Nyquist (High Band). The plots show the
individual transfer functions as well as the overall transfer function Ht.
PCIe Gen 2A Magnitude of Transfer Function
PCIe Gen 2B Magnitude of Transfer Function
For PCI Express Gen 3, one transfer function is defined and the
evaluation is performed over the entire spectrum. The transfer
function parameters are different from Gen 1 and the jitter result is
reported in RMS.
PCIe Gen 3 Magnitude of Transfer Function
For a more thorough overview of PCI Express jitter analysis
methodology, please refer to IDT Application Note PCI Express
Reference Clock Requirements.
Ht s H3 s H1 s H2 s=
Ys Xs H3 s H1 s H2 s=
IDT8T49N008ANLGI REVISION A FEBRUARY 13, 2014 30 ©2014 Integrated Device Technology, Inc.
IDT8T49N008I Data Sheet PROGRAMMABLE FEMTOCLOCK
®
NG LVPECL/LVDS CLOCK GENERATOR WITH 8-OUTPUTS
LVPECL Power Considerations
This section provides information on power dissipation and junction temperature for the IDT8T49N008I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the IDT8T49N008I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 225mA = 779.625mW
Power (outputs)
MAX
= 31.55mW/Loaded Output pair
If all outputs are loaded, the total power is 8 * 31.55mW = 252.4mW
Total Power_
MAX
(3.465V, with all outputs switching) = 779.625W + 252.4mW = 1032.025W
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 32.4°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 1.032W * 32.4°C/W = 118.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resistance
JA
for 40-Lead VFQFN, Forced Convection
JA
by Velocity
Meters per Second 013
Multi-Layer PCB, JEDEC Standard Test Boards 32.4°C/W 25.7°C/W 23.4°C/W

8T49N008A-024NLGI

Mfr. #:
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IDT
Description:
Clock Generators & Support Products FEMTOCLOCK NG
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