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SAM9M10 [SUMMARY]
6355ES–ATARM–12-Mar-13
This package respects the recommendations of the NEMI User Group.
11.2 Soldering Profile
Table 11-5 gives the recommended soldering profile from J-STD-020C.
Note: It is recommended to apply a soldering temperature higher than 250°C
A maximum of three reflow passes is allowed per component.
Table 11-1. Soldering Information
Ball Land 0.4 mm +/- 0.05
Soldering Mask Opening 0.275 mm +/- 0.03
Table 11-2. Device and 324-ball TFBGA Package Maximum Weight
400 mg
Table 11-3. 324-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 11-4. Package Reference
JEDEC Drawing Reference MO-210
JESD97 Classification e1
Table 11-5. Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260 +0 °C
Ramp-down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 min. max.
