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LTC4229IUFD#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
LTC4229
25
4229f
For more information www.linear.com/LTC4229
Typical applicaTion
Diode-ORing on Backplane Application with Ideal Diode First Followed by Hot Swap Control
R6
100k
R7
100k
R8
100k
R9
100k
DCFGDOFF
EN
DFLT
GND INTV
CC
FB
SENSE
+
SENSE
–
UV
OV
DSTAT
RTMR
FAULT
PWRGD
DTMR FTMR
CPO DSRC HGATEIN DSNS OUT
R
H1
10Ω
R
HG1
1k
C
L1
100µF
C
HG1
10nF
V
IN1
12V
12V
7.6A
M
H1
SiR158DP
PLUG-IN
SUPPLY
CARD 1
V
SENSE1
+
V
SENSE1
+
DGATE
M
D1
SiR158DP
R
S1
0.0025Ω
R3
21.5k
R2
1.1k
R1
2k
+
C3
0.1µF
C
FT1
0.1µF
C1
0.1µF
R5
15k
R4
2k
LTC4229
Z1
SMAJ15A
R16
100k
R17
100k
R18
100k
R19
100k
DCFGDOFF
EN
4229 TA02
DFLT
GND INTV
CC
FB
SENSE
+
SENSE
–
UV
OV
DSTAT
RTMR
FAULT
PWRGD
DTMR FTMR
CPO DSRC HGATEIN DSNS
BACKPLANE
OUT
R
H2
10Ω
R
HG2
1k
C
L2
100µF
C
HG2
10nF
V
IN2
12V
M
H2
SiR158DP
PLUG-IN
SUPPLY
CARD 2
V
SENSE2
+
V
SENSE2
+
DGATE
M
D2
SiR158DP
R
S2
0.0025Ω
R13
21.5k
R12
1.1k
R11
2k
+
C4
0.1µF
C
FT2
0.1µF
C2
0.1µF
R15
15k
R14
2k
LTC4229
Z2
SMAJ15A
V
OUT1
V
OUT2
LTC4229
26
4229f
For more information www.linear.com/LTC4229
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.00 ±0.10
(2 SIDES)
5.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
23 24
1
2
BOTTOM VIEW—EXPOSED PAD
0.75 ±0.05
R = 0.115
TYP
R = 0.05 TYP
PIN 1 NOTCH
R = 0.20 OR C = 0.35
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD24) QFN 0506 REV A
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.65 ±0.05
2.00 REF
3.00 REF
4.10 ±0.05
5.50 ±0.05
3.10 ±0.05
4.50 ±0.05
PACKAGE OUTLINE
2.65 ±0.10
2.00 REF
3.00 REF
3.65 ±0.10
3.65 ±0.05
UFD Package
24-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1696 Rev A)
LTC4229
27
4229f
For more information www.linear.com/LTC4229
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
G24 SSOP 0204
0.09 – 0.25
(.0035 – .010)
0° – 8°
0.55 – 0.95
(.022 – .037)
5.00 – 5.60**
(.197 – .221)
7.40 – 8.20
(.291 – .323)
1 2 3 4
5
6
7
8 9 10 11 12
7.90 – 8.50*
(.311 – .335)
2122 18 17 16 15 14
13
19202324
2.0
(.079)
MAX
0.05
(.002)
MIN
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
TYP
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.42 ±0.03 0.65 BSC
5.3 – 5.7
7.8 – 8.2
RECOMMENDED SOLDER PAD LAYOUT
1.25 ±0.12
G Package
24-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

LTC4229IUFD#PBF

Mfr. #:
Buy LTC4229IUFD#PBF
Manufacturer:
Analog Devices Inc.
Description:
Hot Swap Voltage Controllers Ideal Diode & Hot Swap Cntr
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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