Technical Note
2/13
www.rohm.com
2011.05 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
BD95830MUV
●Maximum Absolute Ratings (Ta=25℃)
Parameter Symbol Ratings Unit
Input Voltage VIN1, VIN2, VINS 15.1
*1*2
V
BOOT Voltage BOOT1,BOOT2 21.1
*1*2
V
BOOT-SW Voltage BOOT1-SW1, BOOT2-SW2 7
*1*2
V
Output Voltage VOUT1, VOUT2 7
*1*2
V
Output Feedback Voltage FB1, FB2 VREG V
VREG Voltage VREG 7
*1*2
V
VCC Voltage VCC VREG V
Logic Input Voltage EN1, EN2 15.1
*1*2
V
Power Dissipation 1 Pd1 0.38
*3
W
Power Dissipation 2 Pd2 0.88
*4
W
Power Dissipation 3 Pd3 3.26
*5
W
Power Dissipation 4 Pd4 4.56
*6
W
Operating Temperature Range Topr -20～+100 ℃
Storage Temperature Range Tstg -55～+150 ℃
Maximum Junction Temperature Tjmax +150 ℃
*1 Not to exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 Reduced by 3.04mW/℃ for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board )
*4 Reduced by 7.04mW/℃ for increase in Ta of 1℃ over 25℃.
(when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB(1 layer), copper foil area : 20.2mm
2
)
*5 Reduced by 26.11mW/℃ for increase in Ta of 1℃ over 25℃.
(when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB(4 layer), copper foil area: 20.2mm
2
, 2-3layer: 5505mm
2
)
*6 Reduced by 36.5mW/℃ for increase in Ta of 1℃ over 25℃.
(when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB(4 layer), copper foil area: 5505mm
2
)
●Operating Conditions (Ta=25℃)
Parameter Symbol
Ratings
Unit
Min. Max.
Input Voltage VIN1, VIN2, VINS 7.5 15 V
BOOT Voltage BOOT1, BOOT2 4.5 21 V
SW Voltage SW1, SW2 -0.7 15 V
BOOT-SW Voltage BOOT1-SW1, BOOT2-SW2 4.5 5.5 V
Logic Input Voltage EN1, EN2 0 15 V
Output Voltage VOUT1, VOUT2 0.8 5.5 V
MIN ON TIME tonmin - 100 ns
☆This product should not be used in a radioactive environment.
