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74HC4040N,652
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P20
74HC_HCT4040
All information pr
ovided in this docu
ment is subject t
o legal disclaimers.
© NXP Semiconductor
s N.V
. 2014. All right
s reserv
ed.
Product data sheet
Rev
. 4 — 20 March 2014
13 of 20
NXP Semiconductors
74HC4040; 74HCT4040
12-st
age bin
ary ripple c
ounter
Fig 1
1.
Package
outline SOT109-1 (SO1
6)
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1
99-12-27
03-02-19
076E07
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
0
2.5
5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
74HC_HCT4040
All information pr
ovided in this docu
ment is subject t
o legal disclaimers.
© NXP Semiconductor
s N.V
. 2014. All right
s reserv
ed.
Product data sheet
Rev
. 4 — 20 March 2014
14 of 20
NXP Semiconductors
74HC4040; 74HCT4040
12-st
age bin
ary ripple c
ounter
Fig 12.
Package
outline SOT338-1 (SSOP16
)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
1.25
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
8
0
o
o
0.13
0.2
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT338-1
99-12-27
03-02-19
(1)
w
M
b
p
D
H
E
E
Z
e
c
v
M
A
X
A
y
1
8
16
9
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
MO-150
pin 1 index
0
2.5
5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
A
max.
2
74HC_HCT4040
All information pr
ovided in this docu
ment is subject t
o legal disclaimers.
© NXP Semiconductor
s N.V
. 2014. All right
s reserv
ed.
Product data sheet
Rev
. 4 — 20 March 2014
15 of 20
NXP Semiconductors
74HC4040; 74HCT4040
12-st
age bin
ary ripple c
ounter
Fig 13.
Package ou
tline SOT403-1 (TSSOP16)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
18
16
9
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.1
pin 1 index
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P20
74HC4040N,652
Mfr. #:
Buy 74HC4040N,652
Manufacturer:
NXP Semiconductors
Description:
Counter ICs 12ST BIN RIP COUNTER
Lifecycle:
New from this manufacturer.
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74HC4040N,652
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