MPX4115A
Sensors
4 Freescale Semiconductor
Pressure
Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Fully Integrated Pressure Sensor Schematic
for Unibody Package and Small Outline Package
Table 2. MAXIMUM RATINGS
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum Pressure (P1 > P2)
P
MAX
400 kPa
Storage Temperature T
stg
-40 to +125 °C
Operating Temperature T
A
-40 to +125 °C
Sensing
Element
GND
V
OUT
V
S
Pins 4, 5, and 6 are NO CONNECTS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
for unibody package devices.
3 (Unibody)
2 (Small Outline Package)
4 (Small Outline Package)
1 (Unibody)
3 (Small Outline Package)
2 (Unibody)
MPX4115A
Sensors
Freescale Semiconductor 5
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates an absolute sensing chip in the basic
chip carrier (Case 867) and the small outline chip carrier
(Case 482). A fluorosilicone gel isolates the die surface and
wire bonds from the environment, while allowing the pressure
signal to be transmitted to the sensor diaphragm. The
MPX4115A series pressure sensor operating characteristics,
and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media, other than dry air,
may have adverse effects on sensor performance and long-
term reliability. Contact the factory for information regarding
media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3.
(The output will saturate outside of the specified pressure
range.)
Figure 2. Cross-Sectional Diagram (not to scale)
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For output filtering recommendations, refer to Application Note AN1646.)
Figure 4. Output versus Absolute Pressure
Fluoro Silicone
Gel Die Coat
Die
P1
Metal Cover
Epoxy Plastic
Case
Absolute Element
P2
Lead Frame
Wire Bond
Die
Bond
Stainless Steel
Sealed Vacuum Reference
P1
Fluoro Silicone
Gel Die Coat
Die
Steel Cap
Stainless Steel
Thermoplastic
Case
Die
Bond
Absolute Element
Sealed Vacuum Reference
Lead Frame
Wire Bond
+5.1 V
1.0 μF
0.01 μF
470 pFGND
V
s
V
out
IPS
Output
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
TRANSFER FUNCTION:
V
out
= V
s
* (.009*P-.095) ± Error
V
S
= 5.1 Vdc
TEMP = 0 to 85°C
Pressure (ref. to sealed vacuum) in kPa
TYP
MAX
MIN
5.0
4.5
3.5
4.0
3.0
2.5
2.0
1.5
1.0
0
0.5
Output (Volts)
MPX4115A
Sensors
6 Freescale Semiconductor
Pressure
Nominal Transfer Value: V
out
= V
S
(P x 0.009 - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x V
S
)
V
S
= 5.1 V ± 0.25 Vdc
Transfer Function (MPX4115A)
MPX4115A Series
Temp Multiplier
- 40 3
0 to 85 1
+125 3
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60
14012010080
Temperature
Error
Factor
Temperature Error Band
NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.
Pressure Error (Max)
Error Limits for Pressure
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0
20 40 60 80 100 120
Pressure (in kPa)
Pressure Error (kPa)
15 to 115 (kPa) ±1.5 (kPa)
Pressure Error Band

MPXA4115AC6U

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors PRES SEN BAP AXL PORT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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