MPX4115A
Sensors
Freescale Semiconductor 7
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number Case Type Pressure (P1) Side Identifier
MPX4115A 867 Stainless Steel Cap
MPX4115AP 867B Side with Part Marking
MPX4115AS 867E Side with Port Attached
MPXAZ4115A6U/T1, MPXA4115A6U/T1 482 Side with Part Marking
MPXAZ4115AC6U, MPXA4115AC6U 482A Side with Port Attached
MPXA4115AP 1369 Side with Port Attached
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
