NLAS3899B
http://onsemi.com
9
PACKAGE DIMENSIONS
WQFN16, 1.8x2.6, 0.4P
CASE 488AP
ISSUE B
MOUNTING FOOTPRINT
ǒ
mm
inches
Ǔ
SCALE 20:1
1
0.400
0.0157
0.225
0.0089
0.463
0.0182
0.562
0.0221
2.900
0.1142
1.200
0.0472
2.100
0.0827
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
A
b
A3
A1
0.08 C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
DIM MIN MAX
MILLIMETERS
A
1.80 BSC
A1
0.40 BSC
A3
0.70 0.80
b
D
0.30 0.50
E
e
L
L1
0.20 REF
0.00 0.050
PIN 1 REFERENCE
D A
E
B
0.15 C
2X
0.15 C
2X
0.10 C
C
L2
1
4
5
0.05 C
0.10 CAB
16 X
e
L15 X
0.00 0.15
2.60 BSC
0.15 0.25
8
12
9
16
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
L2
0.40 0.60