REV. B
AD7676
–18–
AD7676*
MC68HC11*
SER/PAR
IRQ
MISO/SDI
SCK
I/O PORT
BUSY
SDOUT
SCLK
CNVST
EXT/INT
CS
RD
INVSCLK
DVDD
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 22. Interfacing the AD7676 to SPI Interface
ADSP-21065L in Master Serial Interface
As shown in Figure 23, the AD7676 can be interfaced to the
ADSP-21065L using the serial interface in Master Mode without
any glue logic required. This mode combines the advantages of
reducing the wire connections and the ability to read the data during
or after conversion maximum speed transfer (DIVSCLK[0:1]
both LOW).
The AD7676 is configured for the Internal Clock Mode (EXT/INT
LOW) and acts, therefore, as the master device. The convert
command can be generated by either an external low jitter oscil-
lator or, as shown, by a FLAG output of the ADSP-21065L or by
a frame output TFS of one serial port of the ADSP-21065L that
can be used like a timer. The Serial Port on the ADSP-21065L
is configured for external clock (IRFS = 0), rising edge active
(CKRE = 1), external late framed sync signals (IRFS = 0,
LAFS = 1, RFSR = 1), and active HIGH (LRFS = 0). The Serial
Port of the ADSP-21065L is configured by writing to its receive
control register (SRCTL)—see the ADSP-2106x SHARC User’s
Manual. Because the Serial Port within the ADSP-21065L will
be seeing a discontinuous clock, an initial word reading has to
be done after the ADSP-21065L has been reset to ensure that
the Serial Port is properly synchronized to this clock during each
following data read operation.
AD7676*
ADSP-21065L*
SHARC
SER/PAR
RFS
DR
RCLK
FLAG OR TFS
SYNC
SDOUT
SCLK
CNVST
RDC/SDIN
RD
EXT/INT
CS
DVDD
*ADDITIONAL PINS OMITTED FOR CLARITY
INVSYNC
INVSCLK
Figure 23. Interfacing to the ADSP-21065L Using
the Serial Master Mode
APPLICATION HINTS
Layout
The AD7676 has very good immunity to noise on the power
supplies as can be seen in Figure 21. However, care should still
be taken with regard to grounding layout.
The printed circuit board that houses the AD7676 should be
designed so the analog and digital sections are separated and
confined to certain areas of the board. This facilitates the use of
ground planes that can be easily separated. Digital and analog
ground planes should be joined in only one place, preferably
underneath the AD7676, or, at least, as close as possible to the
AD7676. If the AD7676 is in a system where multiple devices
require analog to digital ground connections, the connection
should still be made at one point only, a star ground point
that should be established as close as possible to the AD7676.
It is recommended to avoid running digital lines under the device
as these will couple noise onto the die. The analog ground plane
should be allowed to run under the AD7676 to avoid noise
coupling. Fast switching signals like CNVST or clocks should be
shielded with digital ground to avoid radiating noise to other sec-
tions of the board and should never run near analog signal paths.
Crossover of digital and analog signals should be avoided. Traces
on different but close layers of the board should run at right
angles to each other. This will reduce the effect of feedthrough
through the board.
The power supply lines to the AD7676 should use as large a
trace as possible to provide low impedance paths and reduce the
effect of glitches on the power supply lines. Good decoupling is
also important to lower the supply’s impedance presented to
the AD7676 and reduce the magnitude of the supply spikes.
Decoupling ceramic capacitors, typically 100 nF, should be
placed on each power supply’s pins, AVDD, DVDD, and OVDD,
close to and ideally right up against these pins and their corre-
sponding ground pins. Additionally, low ESR 10 µF capacitors
should be located in the vicinity of the ADC to further reduce
low frequency ripple.
The DVDD supply of the AD7676 can be either a separate
supply or come from the analog supply, AVDD, or from the
digital interface supply, OVDD. When the system digital supply
is noisy, or fast switching digital signals are present, it is recom-
mended if no separate supply is available, to connect the DVDD
digital supply to the analog supply AVDD through an RC filter as
shown in Figure 5 and to connect the system supply to the inter-
face digital supply OVDD and the remaining digital circuitry.
When DVDD is powered from the system supply, it is useful to
insert a bead to further reduce high frequency spikes.
The AD7676 has four different ground pins: REFGND, AGND,
DGND, and OGND. REFGND senses the reference voltage and
should be a low impedance return to the reference because it
carries pulsed currents. AGND is the ground to which most inter-
nal ADC analog signals are referenced. This ground must be
connected with the least resistance to the analog ground plane.
DGND must be tied to the analog or digital ground plane,
depending on the configuration. OGND is connected to the
digital system ground.
The layout of the decoupling of the reference voltage is important.
The decoupling capacitor should be close to the ADC and
connected with short and large traces to minimize parasitic
inductances.
Evaluating the AD7676 Performance
A recommended layout for the AD7676 is outlined in the
evaluation board for the AD7676. The evaluation board package
includes a fully assembled and tested evaluation board,
documentation, and software for controlling the board from a
PC via the Eval-Control BRD2.
REV. B
AD7676
–19–
OUTLINE DIMENSIONS
48-Lead Plastic Quad Flatpack [LQFP]
1.4 mm Thick
(ST-48)
Dimensions shown in millimeters
TOP VIEW
(PINS DOWN)
1
12
13
25
24
36
37
48
0.27
0.22
0.17
0.50
BSC
7.00
BSC
SEATING
PLANE
1.60 MAX
0.75
0.60
0.45
VIEW A
7
3.5
0
0.20
0.09
1.45
1.40
1.35
0.15
0.05
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90 CCW
PIN 1
INDICATOR
9.00 BSC
COMPLIANT TO JEDEC STANDARDS MS-026BBC
SEATING
PLANE
48-Lead Frame Chip Scale Package [LFCSP]
(CP-48)
Dimensions shown in millimeters
PIN 1
INDICATOR
TOP
VIEW
6.75
BSC SQ
7.00
BSC SQ
1
48
12
13
37
36
24
25
BOTTOM
VIEW
5.25
4.70
2.25
0.50
0.40
0.30
0.30
0.23
0.18
0.50 BSC
12MAX
0.25
REF
0.70 MAX
0.65 NOM
1.00
0.90
0.80
5.50
REF
SEATING
PLANE
0.05 MAX
0.02 NOM
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
COPLANARITY
0.08
REV. B
–20–
C02690–0–10/02(B)
PRINTED IN U.S.A.
Revision History
Location Page
10/02—Data Sheet changed from REV. A to REV. B.
Added 48-Lead LFCSP to FEATURES and GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Added PulSAR Selection table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Edit to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Additions to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Edits to PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Edit to Transfer Functions section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Changes to Power Supply section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Added 48-Lead Frame Chip Scale Package (LFCSP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

AD7676ASTZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 500kSPS CMOS 16-Bit w/ INL of 1 LSB Max
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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