ADL5354
Rev. 0 | Page 22 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-1
050808-D
1
36
9
10
28
27
19
18
3.85
3.70 SQ
3.55
TOP
VIEW
6.00
BSC SQ
5.75
BSC SQ
COPLANARITY
0.08
4.00
REF
0.75
0.60
0.50
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.20 MIN
EXPOSED
PAD
(BOTTOM VIEW)
PIN 1
INDICATOR
0.35
0.28
0.23
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 56. 36-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad (CP-36-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADL5354ACPZ-R2 −40°C to +85°C 36-Lead LFCSP_VQ CP-36-1
ADL5354ACPZ-R7 −40°C to +85°C 36-Lead LFCSP_VQ CP-36-1
ADL5354-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
