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TDA8034HN/C1,157

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32
TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.4 — 29 June 2016 25 of 32
NXP Semiconductors
TDA8034HN
Low power smart card interface
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 14
) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10
and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 14
.
Table 10. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350
< 2.5 235 220
2.5 220 220
Table 11. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.4 — 29 June 2016 26 of 32
NXP Semiconductors
TDA8034HN
Low power smart card interface
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 14. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 12. Abbreviations
Acronym Description
EMV Europay MasterCard VISA
ESD ElectroStatic Discharge
ESR Equivalent Series Resistor
FCDM Field Charged Device Model
HBM Human Body Model
LDO Low Drop-Out
MM Machine Model
NMOS Negative-channel Metal-Oxide Semiconductor
POR Power-On Reset
TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 3.4 — 29 June 2016 27 of 32
NXP Semiconductors
TDA8034HN
Low power smart card interface
16. Revision history
Table 13. Revision history
Document ID Release date Data sheet status Change notice- Supersedes
TDA8034HN v.3.4 20160629 Product data sheet - TDA8034HN v3.3
Modifications:
• Section 5 “Ordering information”: C2 version added (EMVCo 4.3 compliant)
• Table 7 “Characteristics of IC supply voltage”: values for C2 version added
TDA8034HN v.3.3 20150520 Product data sheet - TDA8034HN v3.2
Modifications:
• Section 2 “Features and benefits”: ESD value updated
• Table 5 “Limiting values”: V
ESD
values updated
TDA8034HN v.3.2 20140325 Product data sheet - TDA8034HN v.3.1
Modifications:
• Change of descriptive title
• Section 2 “Features and benefits”: typos corrected
TDA8034HN v.3.1 20110905 Product data sheet - TDA8034HN v.3.0
Modifications:
• Table 1 “Quick reference data”: values added
• Table 7 “Characteristics of IC supply voltage”: values added
• Figure 1 “Block diagram”: Figure note
(1)
changed
TDA8034HN v.3.0 20110117 Product data sheet - TDA8034HN v.2.0
Modifications:
• Table 2 “Ordering information”: type number updated into TDA8034HN/C1
• Table 3 “Pin description”: Table note
[2]
corrected
TDA8034HN v.2.0 20101112 Product data sheet - TDA8034HN_1
Modifications:
• Table 3 “Pin description”:
Table note
[4]
V
DD
changed into V
DD(INTF)
Table note
[5]
added
IOUC, AUX1UC, AUX2UC referenced to new note
[5]
TDA8034HN_1 20100205 Product data sheet - -
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TDA8034HN/C1,157

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Buy TDA8034HN/C1,157
Manufacturer:
NXP Semiconductors
Description:
Interface - Specialized SMART CARD INTERFACE
Lifecycle:
New from this manufacturer.
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