16
Figure 8. Passive Biasing.
Active Bias
[2]
Due to very high DC power dissipation and small
package constraints, it is recommended that ATF‑521P8
use active biasing. The main advantage of an active
biasing scheme is the ability to hold the drain to source
current constant over a wide range of temperature
variations.
A very inexpensive method of accomplishing this
is to use two PNP bipolar transistors arranged in a
current mirror conguration as shown in Figure 9. Due
to resistors R1 and R3, this circuit is not acting as a
true current mirror, but if the voltage drop across R1
and R3 is kept identical then it still displays some of
the more useful characteristics of a current mirror. For
example, transistor Q1 is congured with its base and
collector tied together. This acts as a simple PN junction,
which helps temperature compensate the Emitter‑Base
junction of Q2.
To calculate the values of R1, R2, R3, and R4 the
following parameters must be know or chosen rst:
I
ds
is the device drain‑to‑source current;
I
R
is the Reference current for active bias;
V
dd
is the power supply voltage available;
V
ds
is the device drain‑to‑source voltage;
V
g
is the typical gate bias;
V
be1
is the typical Base‑Emitter turn on voltage for Q1 &
Q2;
Therefore, resistor R3, which sets the desired device
drain current, is calculated as follows:
R3 =
V
dd
V
ds
(4)
p
I
ds
+ I
C2
where,
I
C2
is chosen for stability to be 10 times the typical gate
current and also equal to the reference current I
R
.
The next three equations are used to calculate the
rest of the biasing resistors for Figure 9. Note that the
voltage drop across R1 must be set equal to the voltage
drop across R3, but with a current of I
R
.
R1 =
V
dd
V
ds
(5)
I
R
R2 sets the bias current through Q1.
R2 =
V
ds
V
be1
(6)
p
I
R
R4 sets the gate voltage for ATF‑521P8.
R4 =
V
g
(7)
p
I
C 2
Thus, by forcing the emitter voltage (V
E
) of transistor
Q1 equal to V
ds
, this circuit regulates the drain current
similar to a current mirror. As long as Q2 operates in the
forward active mode, this holds true. In other words, the
Collector‑Base junction of Q2 must be kept reversed
biased.
C1
RF
in
RF
ou
t
L4
L1
L2
L3
R6
R5
R3
R4
C4
C3
C7
C8
C6
C5
Q2
C2
R1
R2
Q1
V
E
V
g
V
ds
Vdd
2
7
ATF-521P8
2PL
Figure 9. Active Bias Circuit.
INPUT
OUTPUT
Zo
C1
C4
Zo
C5
C6
Vdd
R3
L4
L1
R4
R5
C3
C2
R1
R2
Q1
I
b
17
PCB Layout
A recommended PCB pad layout for the Leadless Plastic
Chip Carrier (LPCC) package used by the ATF‑521P8 is
shown in Figure 10. This layout provides plenty of plated
through hole vias for good thermal and RF grounding. It
also provides a good transition from microstrip to the
device package. For more detailed dimensions refer to
Section 9 of the data sheet.
This simplies RF grounding by reducing the amount
of inductance from the source to ground. It is also
recommended to ground pins 1 and 4 since they are
also connected to the device source. Pins 3, 5, 6, and 8
are not connected, but may be used to help dissipate
heat from the package or for better alignment when
soldering the device.
This three‑layer board (Figure 12) contains a 10‑mil layer
and a 52‑mil layer separated by a ground plane. The rst
layer is Getek RG200D material with dielectric constant
of 3.8. The second layer is for mechanical rigidity and
consists of FR4 with dielectric constant of 4.2.
High Linearity Tx Driver
The need for higher data rates and increased voice
capacity gave rise to a new third generation standard
know as Wideband CDMA or UMTS. This new standard
requires higher performance from radio components
such as higher dynamic range and better linearity. For
example, a WCDMA waveform has a very high peak to
average ratio which forces ampliers in a transmit chain
to have very good Adjacent Channel Leakage power
Ratio or ACLR, or else operate in a backed o mode.
If the amplier is not backed o then the waveform is
compressed and the signal becomes very nonlinear.
This application example presents a highly linear
transmit drive for use in the 2.14GHz frequency range.
Using the RF matching techniques described earlier,
ATF‑521P8 is matched to the following input and output
impedances:
Figure 12. ATF-521P8 demoboard.
Pin 8
Source
(Thermal/RF Gnd)
Pin 7 (Drain)
Pin 6
Pin 5
Pin 1 (Source)
Pin 2 (Gate)
Pin 3
Pin 4 (Source)
Bottom View
J1
J2
BCV62B
C1
C8
0
0
L3
R1
R2
R3
R4
R5
R6
L4
C2
C3
C5
C6
C4
C7
L2
L1
short
Figure 10. Microstripline Layout.
RF Grounding
Unlike SOT packages, ATF‑521P8 is housed in a leadless
package with the die mounted directly to the lead
frame or the belly of the package shown in Figure 11.
Figure 11. LPCC Package for ATF-521P8.
18
Figure 13. ATF-521P8 Matching.
As described previously the input impedance must
be matched to S11* in order to guarantee return loss
greater than 10 dB. A high pass network is chosen for
this match. The output is matched to Γ
L
with another
high pass network. The next step is to choose the
proper DC biasing conditions. From the data sheet,
ATF‑521P8 produces good linearity at a drain current
of 200mA and a drain to source voltage of 4.5V. Thus to
construct the active bias circuit described, the following
parameters are given:
Ids = 200 mA
I
R
= 10 mA
V
dd
= 5 V
V
ds
= 4.5V
V
g
= 0.62V
V
be1
= 0.65 V
Using equations 4, 5, 6, and 7, the biasing resistor values
are calculated in column 2 of table 1, and the actual
values used are listed in column 3.
Table 1. Resistors for Active Bias.
Resistor Calculated Actual
R1 50Ω 49.9Ω
R2 385Ω 383Ω
R3 2.38Ω 2.37Ω
R4 62Ω 61.9Ω
The entire circuit schematic for a 2.14 GHz Tx driver
amplier is shown below in Figure 14. Capacitors C4,
C5, and C6 are added as a low frequency bypass. These
terminate second order harmonics and help improve
linearity. Resistors R5 and R6 also help terminate low
frequencies, and can prevent resonant frequencies
between the two bypass capacitors.
Performance of ATF-521P8 at 2140 MHz
ATF‑521P8 delivers excellent performance in the
WCDMA frequency band. With a drain‑to‑source voltage
of 4.5V and a drain current of 200 mA, this device has
16.5 dB of gain and 1.55 dB of noise gure as show in
Figure 15.
Figure 14. 2140 MHz Schematic.
C1=1.2pF
RF
in
RF
ou
t
L4=3.9nH
L1=1.0nH
L2=12nH
L3=39nH
R6=1.2
R5=10
R3=2.37
R4=61.9
C4=1µF
C3=4.7pF
C8=1.5pF
C7=150pF
C5=1µF
C6=.1µF
Q2
IC2
I
R
C2=1.5nH
R1=49.9
R2=383
Q1
V
be1
+
V
g
V
ds
+5V
2
7
ATF-521P8
2PL
Input
Match
Output
Match
2PL
50 Ohm
S11* = 0.89 -169 Γ
L
= 0.53 -176
50 Ohm

ATF-521P8-TR1

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
RF JFET Transistors Transistor GaAs High Linearity
Lifecycle:
New from this manufacturer.
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