DAC08 Data Sheet
Rev. D | Page 18 of 21
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-001-BB
0.022
0.018
0.015
0.150
0.130
0.115
0.070
0.060
0.055
0.021
0.016
0.011
0.045
0.039
0.030
0.195
0.130
0.115
16
1
8
9
0.100
BSC
0.775
0.755
0.735
0.210
MAX
0.015
MIN
0.280
0.250
0.240
0.430
MAX
0.012
0.010
0.008
0.325
0.310
0.300
0.015
GAUGE
PLANE
03-07-2014-D
SEATING
PLANE
TOP VIEW
SIDE VIEW
END VIEW
PIN 1
INDICATOR
Figure 34. 16-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-16)
Dimensions shown in inches
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.840 (21.34) MAX
15°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
0.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.310 (7.87)
0.220 (5.59)
0.005 (0.13) MIN
0.098 (2.49) MAX
0.100 (2.54) BSC
PIN 1
1
8
9
16
SEATING
PLANE
0.150
(3.81)
MIN
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
Figure 35. 16-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-16)
Dimensions shown in inches and (millimeters)
Data Sheet DAC08
Rev. D | Page 19 of 21
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN P
ARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ON
LY
AND ARE NOT
APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC ST
ANDARDS MS-012-AC
10.00 (0.3937)
9.80 (0.3858)
16
9
8
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARIT
Y
0.10
060606-A
45°
Figure 36. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-16)
Dimensions shown in millimeters and (inches)
1
20
4
9
8
13
19
14
3
18
BOTTOM
VIEW
0.028 (0.71)
0.022 (0.56)
45° TYP
0.015 (0.38)
MIN
0.055 (1.40)
0.045 (1.14)
0.050 (1.27)
BSC
0.075 (1.91)
REF
0.011 (0.28)
0.007 (0.18)
R TYP
0.095 (2.41)
0.075 (1.90)
0.100 (2.54) REF
0.200 (5.08)
REF
0.150 (3.81)
BSC
0.075 (1.91)
REF
0.358 (9.09)
0.342 (8.69)
SQ
0.358
(9.09)
MAX
SQ
0.100 (2.54)
0.064 (1.63)
0.088 (2.24)
0.054 (1.37)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 37. 20-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-20-1)
Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Model
1, 2, 3
NL Temperature Range Package Description Package Option No. Parts Per Container
DAC08AQ ±0.10% 55°C to +125°C 16-Lead CERDIP Q-16 25
DAC08AQ/883C ±0.10% 55°C to +125°C 16-Lead CERDIP Q-16 25
DAC08HQ ±0.10% C to 70°C 16-Lead CERDIP Q-16 25
DAC08Q ±0.19% 55°C to +125°C 16-Lead CERDIP Q-16 25
DAC08RC/883C ±0.19% 55°C to +125°C 20-Terminal LCC E-20-1 55
DAC08EQ ±0.19% 0°C to 70°C 16-Lead CERDIP Q-16 25
DAC08ES ±0.19% 0°C to 70°C 16-Lead SOIC R-16 47
DAC08ESZ ±0.19% 0°C to 70°C 16-Lead SOIC R-16 47
DAC08ESZ-REEL ±0.19% 0°C to 70°C 16-Lead SOIC R-16 2500
DAC08CP ±0.39% 40°C to +85°C 16-Lead PDIP N-16 25
DAC08CPZ ±0.39% 40°C to +85°C 16-Lead PDIP N-16 25
DAC08CS ±0.39% 40°C to +85°C 16-Lead SOIC R-16 47
DAC08CS-REEL ±0.39% 40°C to +85°C 16-Lead SOIC R-16 2500
DAC08CSZ ±0.39% 40°C to +85°C 16-Lead SOIC R-16 47
DAC08CSZ-REEL ±0.39% 40°C to +85°C 16-Lead SOIC R-16 2500
DAC08EPZ
±0.19%
0°C to 70°C
16-Lead PDIP
N-16
25
1
Devices processed in total compliance to MIL-STD-883. Consult the factory for the 883 data sheet.
2
For availability and burn-in information on the SOIC package, contact your local sales office.
3
Z = RoHS Compliant Part.
DAC08 Data Sheet
Rev. D | Page 20 of 21
NOTES

DAC08CSZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC IC 8-BIT HIGH-Spd MULTIPLY
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union