Reliability
Micron’s SSDs incorporate advanced technology for defect and error management.
They use various combinations of hardware-based error correction algorithms and
firmware-based static and dynamic wear-leveling algorithms.
Over the life of the SSD, uncorrectable errors may occur. An uncorrectable error is de-
fined as data that is reported as successfully programmed to the SSD but when it is read
out of the SSD, the data differs from what was programmed.
Table 8: Uncorrectable Bit Error Rate
Uncorrectable Bit Error Rate Operation
1 sector per 10
17
bits read READ
Mean Time to Failure
The mean time to failure (MTTF) for the device can be predicted based on the compo-
nent reliability data using the methods referenced in the Telcordia SR-322 reliability
prediction procedures for electronic equipment.
Table 9: MTTF
Capacity MTTF (Operating Hours)
350GB
2 million
700GB
Endurance
Endurance for the device can be predicted based on the usage conditions applied to the
device, the internal NAND component PROGRAM/ERASE cycles, the write amplifica-
tion factor, and the wear-leveling efficiency of the drive. The table below shows the
drive lifetime for each SSD density based on predefined usage conditions. The SSD im-
plements wear leveling in hardware to optimize performance and efficiency while
maintaining Flash endurance.
Table 10: Drive Lifetime
Capacity Workload Total Bytes Written Drive Fills Per Day Retention
350GB 4KB random writes 25PB 39 1 year
128KB sequential writes 50PB 78 1 year
700GB 4KB random writes 50PB 39 1 year
128KB sequential writes 100PB 78 1 year
P320h HHHL PCIe NAND SSD
Reliability
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Electrical and Environmental Characteristics
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other condi-
tions above those indicated in the operational sections of this specification is not im-
plied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
Table 11: Operating Voltage and Power
Electrical Characteristic Value
Voltage requirement +12Vdc (±8%)
Active power 25W RMS
Standby power (idle) 10W
Table 12: Environmental Conditions
Temperature and Airflow Min Max Unit Notes
Operating temperature (as indicated by SMART temper-
ature)
0 85 °C 1
Operating ambient temperature 0 55 °C 2
Storage temperature (in system) 0 40 °C 3
Storage temperature (offline) –40 85 °C 4
Operating airflow 1.0 m/s 5
Notes:
1. If SMART temperature exceeds 85°C, write performance is throttled.
2. Temperature of air impinging on the drive.
3. Assumes system is powered off and ready to be powered on.
4. Contact Micron for additional information.
5. Airflow must flow along the length of the drive, parallel to and through any cooling
fins; 1.5m/s operating airflow is recommended.
Table 13: Shock and Vibration
Parameter/Condition Specification
Shock 400g at 2ms
Vibration 3.1 grms 5–800Hz at 30 min/axis
P320h HHHL PCIe NAND SSD
Electrical and Environmental Characteristics
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
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Compliance
The device complies with the following specifications:
RoHS - Restriction of Hazardous Substances
China RoHS
WEEE Waste Electric and Electronic Equipment
Halogen Free - meets IPC low-halogen requirements
CE (Europe) EN55022/EN55024 (Class A)
TUV (Germany) EN60950
UL (US/Canada) EN60950
FCC (US) 47CFR Part 15 Class A
BSMI (Taiwan) CNS 13438 Class A
VCCI (Japan) EN 55022/CISPR 22 Class A
C-TICK (AUS/NZ) CISPR22
ICES (Canada) CISPR22 Class A
KC (Korea) - EN55022/EN55024 Class A, KCC-REM-MU2-P320hHHHL
FCC Rules
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide rea-
sonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio fre-
quency energy and, if not installed and used in accordance with the instruction manual,
may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the user will be
required to correct the interference at his own expense.
References
PCI Express Base Specification V2.1
PCI Express CEM Specification V2.0
ATA8-ACS2 Specification
IDEMA Specification
Telcordia SR-322 Procedures
SNIA Performance Test Specification V1.0
P320h HHHL PCIe NAND SSD
Compliance
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.

MTFDGAR350SAH-1N3AB

Mfr. #:
Manufacturer:
Micron
Description:
SSD 350GB PCIE 2.0 SLC 12V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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