15
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FN6582.1
November 3, 2009
ISL54063, ISL54064
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
6
B
E
A
D
0.10 C
2X
C
0.05 C
A
0.10 C
A1
SEATING PLANE
INDEX AREA
21
N
TOP VIEW
SIDE VIEW
NX (b)
SECTION "C-C"
e
CC
5
C
L
TERMINAL TIP
(A1)
L
0.10 C
2X
L1
e
NX L
BOTTOM VIEW
5
7
21
PIN #1 ID
(DATUM A)
(DATUM B)
0.10 M C A B
0.05 M C
NX b
10X
5
0.50
0.20
0.40
1.80
0.40
0.20
2.20
1.00
0.60
1.00
LAND PATTERN
10
L10.1.8x1.4A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
SYMBOL
MILLIMETERS
NOTESMIN NOMINAL MAX
A 0.45 0.50 0.55 -
A1 - - 0.05 -
A3 0.127 REF -
b 0.15 0.20 0.25 5
D 1.75 1.80 1.85 -
E 1.35 1.40 1.45 -
e 0.40 BSC -
L 0.35 0.40 0.45 -
L1 0.45 0.50 0.55 -
N102
Nd 2 3
Ne 3 3
θ
0-12
4
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
