Vishay Siliconix
SiR770DP
Document Number: 66818
S10-1923-Rev. A, 23-Aug-10
www.vishay.com
1
Dual N-Channel 30 V (D-S) MOSFET with Schottky Diode
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET
®
Power MOSFET
• 100 % R
g
and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Fixed Telecom
- Server
• Synchronous Converter
PRODUCT SUMMARY
V
DS
R
DS(on)
()I
D
(A)
a, f
Q
g
(Typ.)
Channel-1 30
0.021 at V
GS
= 10 V 8.0
6.6
0.025 at V
GS
= 4.5 V 8.0
Channel-2 30
0.021 at V
GS
= 10 V 8.0
6.6
0.025 at V
GS
= 4.5 V 8.0
SCHOTTKY PRODUCT SUMMARY
V
DS
(V)
V
SD
(V)
Diode Forward Voltage I
F
(A)
a
30 0.50 V at 1.0 A 4.0
1
2
3
4
5
6
7
8
S1
G1
S2
G2
D1
D1
D2
D2
6.15 mm
5.15 mm
Bottom View
PowerPAK SO-8
Ordering Information: SiR770DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
D
1
G
1
S
1
N-Channel MOSFET
D
2
G
2
S
2
Schottky Diode
Notes:
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257
). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Package limited.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Channel-1 Channel-2 Unit
Drain-Source Voltage
V
DS
30 30
V
Gate-Source Voltage
V
GS
± 20 ± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
8
f
8
f
A
T
C
= 70 °C
8
f
8
f
T
A
= 25 °C
8
b, c, f
8
b, c, f
T
A
= 70 °C
8
b, c, f
8
b, c, f
Pulsed Drain Current (300 µs)
I
DM
35 35
Source-Drain Current Diode Current
T
C
= 25 °C
I
S
8
f
8
f
T
A
= 25 °C
3
b, c
3
b, c
Pulsed Source-Drain Current
I
SM
35 35
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
15 15
Single Pulse Avalanche Energy
E
AS
11.2 11.2
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
17.8 17.8
W
T
C
= 70 °C
11.4 11.4
T
A
= 25 °C
3.6
b, c
3.6
b, c
T
A
= 70 °C
2.3
b, c
2.3
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260