Data Sheet ADG774A
Rev. C | Page 13 of 14
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
09-12-2014-A
Figure 29. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches and (millimeters)
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1.65
1.50 SQ
1.45
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED-6.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
01-26-2012-A
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-27)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG774ABRQ-REEL7
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQZ
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQZ-REEL
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQZ-REEL7
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABCPZ-REEL
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-27
ADG774ABCPZ-R2
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-27
1
Z = RoHS Compliant Part.
