2N7002F_3 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 03 — 28 April 2006 5 of 12
Philips Semiconductors
2N7002F
N-channel TrenchMOS FET
6. Characteristics
Table 5: Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
=10µA; V
GS
=0V
T
j
=25°C 60--V
T
j
= −55 °C 55--V
V
GS(th)
gate-source threshold voltage I
D
= 0.25 mA; V
DS
=V
GS
; see Figure 9 and 10
T
j
=25°C 1 2 2.5 V
T
j
= 150 °C 0.6 - - V
T
j
= −55 °C - - 2.75 V
I
DSS
drain leakage current V
DS
=48V; V
GS
=0V
T
j
=25°C - 0.01 1 µA
T
j
= 150 °C --10µA
I
GSS
gate leakage current V
GS
= ±15 V; V
DS
= 0 V - 10 100 nA
R
DSon
drain-source on-state
resistance
V
GS
= 10 V; I
D
= 500 mA; see Figure 6 and 8
T
j
=25°C - 0.78 2 Ω
T
j
= 150 °C - 1.45 3.7 Ω
V
GS
= 4.5 V; I
D
= 75 mA; see Figure 6 and 8 - 1.2 4 Ω
Dynamic characteristics
Q
G(tot)
total gate charge
I
D
= 300 mA; V
DS
=30V; V
GS
=10V;
see
Figure 11 and 12
- 0.69 - nC
Q
GS
gate-source charge - 0.1 - nC
Q
GD
gate-drain charge - 0.27 - nC
C
iss
input capacitance V
GS
=0V; V
DS
= 10 V; f = 1 MHz;
see
Figure 14
- 3150pF
C
oss
output capacitance - 6.8 30 pF
C
rss
reverse transfer capacitance - 3.5 10 pF
t
on
turn-on time V
DS
=50V; R
L
= 250 Ω; V
GS
=10V;
R
G
=50Ω; R
GS
=50Ω
- 2.5 10 ns
t
off
turn-off time - 11 15 ns
Source-drain diode
V
SD
source-drain voltage I
S
= 300 mA; V
GS
= 0 V; see Figure 13 - 0.85 1.5 V
t
rr
reverse recovery time I
S
= 300 mA; dI
S
/dt = −100 A/µs; V
GS
=0V - 30 - ns
Q
r
recovered charge - 30 - nC