NTY100N10G

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4
POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted
by recognizing that the power MOSFET is charge
controlled. The lengths of various switching intervals (Dt)
are determined by how fast the FET input capacitance can
be charged by current from the generator.
The published capacitance data is difficult to use for
calculating rise and fall because draingate capacitance
varies greatly with applied voltage. Accordingly, gate
charge data is used. In most cases, a satisfactory estimate
of average input current (I
G(AV)
) can be made from a
rudimentary analysis of the drive circuit so that
t = Q/I
G(AV)
During the rise and fall time interval when switching a
resistive load, V
GS
remains virtually constant at a level
known as the plateau voltage, V
SGP
. Therefore, rise and fall
times may be approximated by the following:
t
r
= Q
2
x R
G
/(V
GG
V
GSP
)
t
f
= Q
2
x R
G
/V
GSP
where
V
GG
= the gate drive voltage, which varies from zero to
V
GG
R
G
= the gate drive resistance
and Q
2
and V
GSP
are read from the gate charge curve.
During the turnon and turnoff delay times, gate current
is not constant. The simplest calculation uses appropriate
values from the capacitance curves in a standard equation
for voltage change in an RC network. The equations are:
t
d(on)
= R
G
C
iss
In [V
GG
/(V
GG
V
GSP
)]
t
d(off)
= R
G
C
iss
In (V
GG
/V
GSP
)
The capacitance (C
iss
) is read from the capacitance curve
at a voltage corresponding to the offstate condition when
calculating t
d(on)
and is read at a voltage corresponding to
the onstate when calculating t
d(off)
.
At high switching speeds, parasitic circuit elements
complicate the analysis. The inductance of the MOSFET
source lead, inside the package and in the circuit wiring
which is common to both the drain and gate current paths,
produces a voltage at the source which reduces the gate
drive current. The voltage is determined by Ldi/dt, but
since di/dt is a function of drain current, the mathematical
solution is complex. The MOSFET output capacitance also
complicates the mathematics. And finally, MOSFETs have
finite internal gate resistance which effectively adds to the
resistance of the driving source, but the internal resistance
is difficult to measure and, consequently, is not specified.
The resistive switching time variation versus gate
resistance (Figure 9) shows how typical switching
performance is affected by the parasitic circuit elements. If
the parasitics were not present, the slope of the curves
would maintain a value of unity regardless of the switching
speed. The circuit used to obtain the data is constructed to
minimize common inductance in the drain and gate circuit
loops and is believed readily achievable with board
mounted components. Most power electronic loads are
inductive; the data in the figure is taken with a resistive
load, which approximates an optimally snubbed inductive
load. Power MOSFETs may be safely operated into an
inductive load; however, snubbing reduces switching
losses.
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0
4000
8000
12000
16000
20000
10 5 0 5 10 15 20 25
Figure 7. Capacitance Variation
C, CAPACITANCE (pF)
T
J
= 25°C
C
iss
C
oss
C
iss
C
rss
V
GS
= 0V
DS
= 0
0
2.0
4.0
6.0
8.0
10
0 50 100 150 200
0
20
40
60
80
100
V
GS
, GATETO SOURCE
VOLTAGE (V)
V
DS
, DRAINTOSOURCE
VOLTAGE (V)
V
DS
V
GS
Q2
Q
T
Q1
Q3
I
DS
=100 A
T
J
= 25°C
Figure 8. GatetoSource and DraintoSource
Voltage versus Total Charge
Q
g
, TOTAL GATE CHARGE (nC)
1.0
10
100
1000
10000
1 10 100
t, TIME (nC)
Figure 9. Resistive Switching Time Variation
versus Gate Resistance
R
G
, GATE RESISTANCE (W)
I
S
, SOURCE CURRENT (A)
Figure 10. Diode Forward Voltage versus
Current
V
SD
, SOURCETODRAIN VOLTAGE (V)
t
d(off)
t
f
t
r
t
d(on)
V
DD
= 50 V
I
D
= 100 A
V
GS
= 10 V
V
gs
V
ds
0
20
40
60
80
100
0 0.2 0.4 0.6 0.8 1
V
GS
= 0 V
T
J
= 25°C
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6
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous draintosource voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (T
C
) of 25°C.
Peak repetitive pulsed power limits are determined by
using the thermal response data in conjunction with the
procedures discussed in AN569, “Transient Thermal
ResistanceGeneral Data and Its Use.”
Switching between the offstate and the onstate may
traverse any load line provided neither rated peak current
(I
DM
) nor rated voltage (V
DSS
) is exceeded and the
transition time (t
r
,t
f
) do not exceed 10 ms. In addition the
total power averaged over a complete switching cycle must
not exceed (T
J(MAX)
T
C
)/(R
q
JC
).
A Power MOSFET designated EFET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit
inductance dissipated in the transistor while in avalanche
must be less than the rated limit and adjusted for operating
conditions differing from those specified. Although
industry practice is to rate in terms of energy, avalanche
energy capability is not a constant. The energy rating
decreases nonlinearly with an increase of peak current in
avalanche and peak junction temperature.
Although many EFETs can withstand the stress of
draintosource avalanche at currents up to rated pulsed
current (I
DM
), the energy rating is specified at rated
continuous current (I
D
), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 12).
Maximum energy at currents below rated continuous I
D
can
safely be assumed to equal the values indicated.
0.01
0.1
1
10
100
1000
0.1 1 10 100 1000
I
D
, DRAIN CURRENT (A)
Figure 11. Maximum Rated Forward Bias Safe
Operating Area
V
DS
, DRAINTOSOURCE VOLTAGE (V)
V
GS
= 20 V
Single Pulse
T
C
= 25°C
R
DS(on)
Limit
Thermal Limit
Package
Limit
10 ms
100 ms
1 ms
10 ms
dc
0
100
200
300
400
500
25 50 75 100 125 150
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
T
J
, STARTING JUNCTION TEMPERATURE (°C)
I
D
= 100 A
E
AS
, SINGLE PULSE DRAINTOSOURCE
AVALANCHE ENERGY (mJ)

NTY100N10G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET 100V 123A N-Channel
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